{"id":1725,"date":"2022-02-24T11:49:19","date_gmt":"2022-02-24T02:49:19","guid":{"rendered":"https:\/\/issm.semiconportal.net\/2022\/?page_id=1725"},"modified":"2023-02-10T10:13:30","modified_gmt":"2023-02-10T01:13:30","slug":"organization","status":"publish","type":"page","link":"https:\/\/issm.semiconportal.net\/2022\/organization\/","title":{"rendered":"Organization"},"content":{"rendered":"\n

Japan Organizing Committee<\/strong><\/h2>\n\n\n\n
\n
Chairman<\/dt>\n
Shozo Saito, Device & System Platform Development Center Co., Ltd.<\/dd>\n\n
Vice Chairman<\/dt>\n
Shuichi Inoue, ATONARP INC.<\/dd>\n\n
Treasurer<\/dt>\n
Hiroaki Kato, TOSHIBA ELECTRONIC DEVICES & STORAGE Corp. <\/dd>\n\n
Member<\/dt>\n
Tadahiro Suhara, JSR Corporation<\/dd>\n
Michihiro Inoue, National Institute of Advanced Industrial Science and Technology (AIST)<\/dd>\n
Hiroyuki Umimoto, Panasonic Corporation<\/dd>\n
Yasutoshi Okuno, SCREEN Semiconductor Solutions Co., Ltd.<\/dd>\n
Takahito Matsuzawa, Tokyo Electron Ltd.<\/dd>\n
Tomoyuki Sasaki, Tower Partners Semiconductor Co., Ltd.<\/dd>\n
Atsuyoshi Koike, Rapidus Corporation<\/dd>\n
Keiji Horioka<\/dd>\n
Tadashi Nishimura<\/dd>\n<\/dl>\n\n\n\n

Japan Executive Committee<\/strong><\/h2>\n\n\n\n
\n
Chairman<\/dt>\n
Ayako Shimazaki, Toshiba Nanoanalysis Corp.<\/dd>\n
Member<\/dt>\n
Kensuke Uriga, Dura Systems, Inc.<\/dd>\n
Naoyuki Ishiwata, Fujitsu Semiconductor Limited<\/dd>\n
Takeshi Hattori, Hattori Consulting International<\/dd>\n
Hiroshi Akahori, KIOXIA Corporation<\/dd>\n
Toshiyuki Uchino, Kokusai Electric Corporation<\/dd>\n
Katsutoshi Ozawa, OMRON Corp.<\/dd>\n
Hiroyuki Umimoto, Panasonic Corporation<\/dd>\n
Hiroyuki Mori, Renesas Electronics Corporation<\/dd>\n
Takashi Shimane, Rohm Co., Ltd.<\/dd>\n
Yasutoshi Okuno, SCREEN Semiconductor Solutions Co., Ltd.<\/dd>\n
Hiroyuki Chuma, Nisshinbo Holdings Inc.<\/dd>\n
Masahiko Hamajima, SEMI<\/dd>\n
Kiyoshi Watanabe, Semiconductor Equipment Association of Japan (SEAJ)<\/dd>\n
Takahito Matsuzawa, Tokyo Electron, Ltd.<\/dd>\n
Kazuya Okamoto, Yamaguchi University Graduate School<\/dd>\n
Keiji Horioka<\/dd>\n
Makoto Hirayama<\/dd>\n<\/dl>\n\n\n\n

Japan Program Committee<\/strong><\/h2>\n\n\n\n
\n
Chairman<\/dt>\n
Shin-ichi Imai, Hitachi High-Tech Corporation<\/dd>\n\n
Executive Vice Chairman<\/dt>\n
Ayako Shimazaki, Toshiba Nanoanalysis Corp.<\/dd>\n\n
Committee leader<\/dt>\n
Kazunori Kato, Advanced Interface Technology Corp.<\/dd>\n
Isamu Namose, OMRON Corporation<\/dd>\n
Kazuhito Matsukawa, SUMCO Corporation<\/dd>\n
Tomio Otsuki, JX Nippon Mining & Metals Corporation<\/dd>\n\n
ISSM Conference Editor for IEEE TSM<\/dt>\n
Tsuyoshi Moriya, Tokyo Electron Ltd.<\/dd>\n\n
Member<\/dt>\n
Shinsuke Mizuno, Applied Materials Japan, Inc<\/dd>\n
Kazunori Nemoto, Hitachi High Technologies America, Inc.<\/dd>\n
Takanori Kawakami, JSR Corporation<\/dd>\n
Yuji Yamada, KIOXIA Corp.<\/dd>\n
Masami Aoki, KLA-Tencor Japan Ltd.<\/dd>\n
Minoru Akaishi, ON Semiconductor<\/dd>\n
Masahiro Shimbo, ON Semiconductor<\/dd>\n
Kenji Miyake, Office Miyake<\/dd>\n
Kazuki Yokota, Renesas Electronics Corporation<\/dd>\n
Shoji Takei, Rohm Co., Ltd.<\/dd>\n
Kenji Watanabe, Western Digital<\/dd>\n
Takayuki Hisamatsu, Sony Semiconductor Manufacturing Corp.<\/dd>\n
Hiroyuki Inoue, Texas Instruments Japan Limited<\/dd>\n
Shun-ichiro Ohmi, Tokyo Institute of Technology<\/dd>\n
Toshio Konishi, Toppan Photomask Co., Ltd.<\/dd>\n
Takatoshi Yasui, Tower Partners Semiconductor Co., Ltd.<\/dd>\n
Takayuki Matsumoto, United Semiconductor Japan Co., Ltd.<\/dd>\n
Takahiro Tsuchiya, United Semiconductor Japan Co., Ltd.<\/dd>\n
Sumika Arima, University of Tsukuba<\/dd>\n\n
e-Manufacturing & Design Collaboration Conference (eMCD) Advisory Committee<\/dt>\n
Dr. Nicky C.C. Lu, Etron Technology, Inc.<\/dd>\n
Dr. TY Wu, TSIA<\/dd>\n
Ms. Celia Shih, TSIA<\/dd>\n
Mr. Thomas Chen, tsmc<\/dd>\n
Mr. Robert Chien, tsmc<\/dd>\n
Dr. C. Hsu, tsmc<\/dd>\n
Prof. SC Chang, National Taiwan University<\/dd>\n<\/dl>\n","protected":false},"excerpt":{"rendered":"

Japan Organizing Committee Chairman Shozo Saito, Device & System Platform Development Center Co., Ltd. Vic … \u7d9a\u304d\u3092\u8aad\u3080 Organization<\/span> →<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-1725","page","type-page","status-publish","hentry"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/issm.semiconportal.net\/2022\/wp-json\/wp\/v2\/pages\/1725","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/issm.semiconportal.net\/2022\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/issm.semiconportal.net\/2022\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/issm.semiconportal.net\/2022\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/issm.semiconportal.net\/2022\/wp-json\/wp\/v2\/comments?post=1725"}],"version-history":[{"count":13,"href":"https:\/\/issm.semiconportal.net\/2022\/wp-json\/wp\/v2\/pages\/1725\/revisions"}],"predecessor-version":[{"id":2677,"href":"https:\/\/issm.semiconportal.net\/2022\/wp-json\/wp\/v2\/pages\/1725\/revisions\/2677"}],"wp:attachment":[{"href":"https:\/\/issm.semiconportal.net\/2022\/wp-json\/wp\/v2\/media?parent=1725"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}