{"id":2478,"date":"2022-10-28T15:00:40","date_gmt":"2022-10-28T06:00:40","guid":{"rendered":"https:\/\/issm.semiconportal.net\/2022\/?page_id=2478"},"modified":"2022-12-09T09:36:10","modified_gmt":"2022-12-09T00:36:10","slug":"program","status":"publish","type":"page","link":"https:\/\/issm.semiconportal.net\/2022\/program\/","title":{"rendered":"Program"},"content":{"rendered":"\n<ul class=\"top_narrow wp-block-list\">\n<li>Program Schedule is in JST(UTC+9)<\/li>\n\n\n\n<li>Program Schedule is subject to change<\/li>\n<\/ul>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-vertically-aligned-bottom is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"246\" height=\"415\" src=\"https:\/\/issm.semiconportal.net\/2022\/wp-content\/uploads\/sites\/2\/at-a-glance_thumbnail.jpg\" alt=\"ISSM 2022 Program at-a-glance\" class=\"wp-image-2498\" srcset=\"https:\/\/issm.semiconportal.net\/2022\/wp-content\/uploads\/sites\/2\/at-a-glance_thumbnail.jpg 246w, https:\/\/issm.semiconportal.net\/2022\/wp-content\/uploads\/sites\/2\/at-a-glance_thumbnail-178x300.jpg 178w\" sizes=\"auto, (max-width: 246px) 100vw, 246px\" \/><figcaption class=\"wp-element-caption\"><strong><a href=\"https:\/\/issm.semiconportal.net\/2022\/wp-content\/uploads\/sites\/2\/ISSM2022Program_At-a-Glance1108.pdf\" target=\"_blank\" rel=\"noopener\" title=\"\">Click here to the program at-a-glance in PDF<\/a><\/strong><\/figcaption><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-vertically-aligned-bottom is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"374\" height=\"526\" src=\"https:\/\/issm.semiconportal.net\/2022\/wp-content\/uploads\/sites\/2\/issm2022handouttn.gif\" alt=\"\" class=\"wp-image-2658\"\/><figcaption class=\"wp-element-caption\"><strong><a href=\"https:\/\/issm.semiconportal.net\/2022\/wp-content\/uploads\/sites\/2\/ISSM2022handout.pdf\" target=\"_blank\" rel=\"noreferrer noopener\">Click here to the program Handout in PDF<\/a><\/strong><\/figcaption><\/figure>\n<\/div>\n<\/div>\n\n\n\n<div class=\"su-tabs su-tabs-style-default su-tabs-mobile-stack\" data-active=\"1\" data-scroll-offset=\"0\" data-anchor-in-url=\"no\"><div class=\"su-tabs-nav\"><span class=\"\" data-url=\"\" data-target=\"blank\" tabindex=\"0\" role=\"button\">Day 1<\/span><span class=\"\" data-url=\"\" data-target=\"blank\" tabindex=\"0\" role=\"button\">Day 2<\/span><\/div><div class=\"su-tabs-panes\"><div class=\"su-tabs-pane su-u-clearfix su-u-trim\" data-title=\"Day 1\">\n<h2>DAY1 &#8211; December 12th<\/h2>\n<h3>Room : KFC Hall<\/h3>\n<h4>Plenary Session<\/h4>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time\">8:15<\/td>\n<td class=\"tbl_cell\">Registration<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">8:45<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">Opening<\/span><br>MC: Shuichi Inoue, ISSM Organizing Committee Vice Chair<br>Opening Remarks by Shozo Saito, ISSM Organizing Committee Chair<br>Conference Outline by Ayako Shimazaki, ISSM Executive Committee Chair<br>Program Schedule by Shin-ichi Imai, ISSM Program Committee Chair<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">9:00<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">Tutorial Speech-1<br>Challenges of Plasma Science and Technology for Green Semiconductor Manufacturing<\/span><br>\nDr.Masaru Hori, Nagoya University\n<div class=\"chairs\">Session Co-Chairs: Ayako Shimazaki, Toshiba Nanoanalysis \/ Tsuyoshi Moriya, Tokyo Electron<\/div>\n<span class=\"red\">Presentation will be in Japanese. Interpretation into English will be provided.<\/span><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">9:40<\/td>\n<td class=\"tbl_cell\">Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">9:50<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">Tutorial Speech-2<br>Atomic-level control of plasma processing toward sub-nm node technologies<\/span><br>\nDr. Satoshi Hamaguchi, Osaka University\n<div class=\"chairs\">Session Co-Chairs: Ayako Shimazaki, Toshiba Nanoanalysis \/ Tsuyoshi Moriya, Tokyo Electron<\/div>\n<span class=\"red\">Presentation will be in Japanese. Interpretation into English will be provided.<\/span><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">10:30<\/td>\n<td class=\"tbl_cell\">Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">10:40<\/td>\n<td class=\"tbl_cell\">Technical Session A-1 &#038; B-1<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">12:00<\/td>\n<td class=\"tbl_cell\">Sponsor Exhibition (on-site) &#038; Video  (Sponosr: Silver-Platinum)  \/ Lunch Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">12:50<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">Keynote Speech-1<br>Cutting Edge Technologies of Power Semiconductor Device Applications for Electric Vehicle&#8217;s Power Electronics Systems in Japan, US, Europe and China Case<\/span><br>\nDr. Masayoshi Yamamoto, Nagoya University\n<div class=\"chairs\">Session Chair: Kazunori Kato, Advanced Interface Technology<\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">13:30<\/td>\n<td class=\"tbl_cell\">Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">13:40<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\"><span class=\"red\">LIVE ONLY NO Q&#038;A \/ NO ON-Demand<\/span><br>Keynote Speech-2<br>The Contribution and Expectation of TSMC Japan 3DIC R&#038;D Center to Japan Industry<\/span><br>\nMr. Yutaka Emoto, TSMC Japan 3DIC R&#038;D Center, Inc.\n<div class=\"chairs\">Session Chair: Kazuhito Matsukawa, SUMCO <\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">14:20<\/td>\n<td class=\"tbl_cell\">Break<\/td>\n<\/tr>\n<\/table>\n<hr class=\"wp-block-separator has-alpha-channel-opacity is-style-wide\"\/>\n<h3>Room 1 : KFC Hall<\/h3>\n<h4 class=\"bottom_narrow\">Session A-1 : Manufacturing Strategy (MS) &#038; Environment, Safety and Health, Carbon Neutral (ES) &#038; Fab Operation Method (FO)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Katsutoshi Ozawa, OMRON \/ Takahiro Tsuchiya, United Semiconductor Japan<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time\">10:40<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">MS-44 : A Novel Approach to Dynamic Line Balance Control and Scheduling with a Digital Twin Production System<\/span><br>\nHirofumi Tsuchiyama, INFICON<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">11:00<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">ES-62 : Self-tuning optimization to compatible the delivery and low energy consumption<\/span><br>\nChending MAO, University of Tsukuba<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">11:20<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span><br>FO-43 : Maintenance Content Reduction and Digitalization for Performance Optimization<\/span><br>\nChristopher Bode, INFICON<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">11:40<\/td>\n<td class=\"tbl_cell\">Author&#8217;s Interview (On-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">12:00<\/td>\n<td class=\"tbl_cell\">Sponsor Exhibition (on-site) &#038; Video (Sponosr: Silver-Platinum) \/ Lunch Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">12:50 &#8211; 14:30<\/td>\n<td class=\"tbl_cell\">Plenary Session<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow\">Session A-2: Invited &#038; Highlight AI<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Isamu Namose, OMRON \/ Takatoshi Yasui, Tower Partners Semiconductor<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time\">14:30<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\"><span class=\"blue\">Invited<\/span><br>EDTM-01 : Inter Spike Interval and Stochasticity Engineering of Floating Gate Technology-based Neurons for Spiking Neural Network Hardware<\/span><br>\nAkira Goda, University of Tokyo<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">14:50<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">YD-21 : Noise Reduction in SEM Images using Deep Learning<\/span><br>\nYuki Sato, Tokyo Electron<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">15:10<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">ID-6 : Application of Natural Language Processing in Semiconductor Manufacturing<\/span><br>\nDaisuke Kobayashi, Sony Semiconductor Manufacturing Corporation<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">15:30<\/td>\n<td class=\"tbl_cell\">Author&#8217;s Interview &#038; Exhibition (On-Site ONLY)&#038; Break<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow\">Session A-3:  Highlight  AI<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Takatoshi Yasui, Tower Partners Semiconductor \/ Masami Aoki, KLA-Tencor Japan<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time\">16:00<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">YD-10 : Positive\/Negative Decision via Outlier Detection Towards Automatic Performance Evaluation for Defect Detector<\/span><br>\nToshinori Yamauchi, Hitachi High-Tech<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">16:20<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">YD-15 : A Study on Detection Method Using 2-Class Classifiers for Defective Wafer Maps<\/span><br>\nSeima Sakaguchi, Mie University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">16:40<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span><br>YD-5 : Yield prediction with Machine Learning and parameter limits in semiconductor production<\/span><br>\nRebecca Busch, University of Siegen<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">17:00<\/td>\n<td class=\"tbl_cell\">Author&#8217;s Interview  (On-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow\">Session A-4: Invited &#038; Yield &#038; Defect Control (YD) &#038; Manufacturing Technology for Variety Devices (VD)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Kenji Watanabe, Western Digital \/ Tomio Otsuki, JX Nippon Mining &#038; Metals<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time\">17:20<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\"><span class=\"blue\">Invited<\/span>&nbsp;<span class=\"orange\">ONLINE<\/span><br>IITC-01 : Dual Damascene 28nm\u2010Pitch Single Exposure EUV Design Rules Evaluation by Voltage Contrast Characterization<\/span><br>\nVictor M. Carballo, IMEC<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">17:40<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span><br>YD-35 : Automatic classification of C-SAM voids for root cause identification of bonding yield degradation<\/span><br>\nJulien Baderot, Pollen Metrology<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">18:00<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">VD-33 : Hydrogen diffusion behavior of CH4N-molecular-ion-implanted wafers for 3D-stacked CMOS image sensors<\/span><br>\nRyosuke Okuyama, SUMCO<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">18:20<\/td>\n<td class=\"tbl_cell\">Author&#8217;s Interview (On-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">18:40<\/td>\n<td class=\"tbl_cell\"><\/td>\n<\/tr>\n<\/table>\n<hr class=\"wp-block-separator has-alpha-channel-opacity is-style-wide\"\/>\n<h3>Room2: KFC Hall Annex<\/h3>\n<h4 class=\"bottom_narrow\">Session B-1: Invited &#038; Process\/Material Optimization (PO)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Tsuyoshi Moriya, Tokyo Electron \/ Hiroyuki Inoue, Texas Instruments Japan<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_r2\">10:40<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\"><span class=\"blue\">Invited<\/span><br>EDTM-02 : Experimental Analysis of Process Impacts on Fluorine Incorporated Gate Oxide Film Properties Near Gate Edge Region<\/span><br>\nShuntaro Fujii, Asahi Kasei<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">11:00<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\">PO-63 : Nanoimprint Lithography with CO2 Ambient<\/span><br>\nToshiki ITO, Canon<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">11:20<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\">PO-11 : Impact of cation vacancies on leakage current on TiN\/ZrO2\/TiN capacitors studied by positron annihilation<\/span><br>\nAkira Uedono, University of Tsukuba<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">11:40<\/td>\n<td class=\"tbl_cell_r2\">Author&#8217;s Interview (On-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">12:00<\/td>\n<td class=\"tbl_cell_r2\">Sponsor Exhibition &#038; Video (Sponosr: Silver-Platinum) \/ Lunch Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">12:50 &#8211; 14:30<\/td>\n<td class=\"tbl_cell_r2\">Plenary Session<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow\">Session B-2: Invited &#038; Process\/Material Optimization (PO)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Kazunori Kato, Advanced Interface Technology \/ Shun-ichiro Ohmi, Tokyo Institute of Technology<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_r2\">14:30<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\"><span class=\"blue\">Invited<\/span>&nbsp;<span class=\"orange\">ONLINE<\/span><br>IITC-02 : TSV fabrication technology using direct electroplating of Cu on the electroless plated barrier metal<\/span><br>\nShoso Shingubara, Kansai University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">14:50<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\">PO-42 : Ultra-fast Etching of Photoresist by Reactive Atmospheric-pressure Micro-Thermal Plasma Jet<\/span><br>\nHibiki Kato, Hiroshima University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">15:10<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span><br>PO-28 : Optimization of RF frequencies in dual-frequency capacitively coupled plasma apparatus using genetic algorithm (GA) and plasma simulation<\/span><br>\nShigeyuki Takagi, Tokyo University of Technology<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">15:30<\/td>\n<td class=\"tbl_cell_r2\">Author&#8217;s Interview &#038; Exhibition (On-Site) &#038; Break<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow\">Session B-3: Invited &#038; Process\/Material Optimization (PO)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Shun-ichiro Ohmi, Tokyo Institute of Technology \/ Yuji Yamada, KIOXIA <\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_r2\">16:00<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\"><span class=\"blue\">Invited<\/span><br>EDTM-03 : Temperature Dependence of Current-Voltage Characteristics of Ionic Liquid Type Intelligent Connection Device<\/span><br>\nMasakazu Kobayashi, Nagase<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">16:20<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\">PO-40 : Deposition rate dependence of the 5 nm-thick ferroelectric nondoped HfO2 on MFSFET characteristics<\/span><br>\nMasakazu Tanuma, Tokyo Institute of Technology<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">16:40<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span><br>PO-55 : Process Optimization for Ge-on-Si depletion mode transistors using mesa architecture<\/span><br>\nSumit Choudhary, Indian Institute of Technology, (IIT), Mandi<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">17:00<\/td>\n<td class=\"tbl_cell_r2\">Author&#8217;s Interview (On-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow\">Session B-4: Material Informatics (MI) &#038; New Gas, New Liquid, and New Resist Technologies (NM)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Shinsuke Mizuno, Applied Materials Japan \/ Takanori Kawakami, JSR<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_r2\">17:20<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span><br>MI-25 : Systematic search for stabilizing dopants in ZrO2 and HfO2 using first-principles calculations<\/span><br>\nYosuke Harashima, Nara Institute of Science and Technology<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">17:40<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\">NM-23 : Recent status of EUV lithography, what is the stochastic issues ?<\/span><br>\nToru Fujimori, FUJIFILM<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">18:00<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\">NM-45 : Technology Trends and Characteristics of Patent Information Disclosure in Advanced Semiconductor Photoresist<\/span><br>\nKosuke Watahiki, Yamaguchi University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">18:20<\/td>\n<td class=\"tbl_cell_r2\">Author&#8217;s Interview(On-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">18:40<\/td>\n<td class=\"tbl_cell_r2\"><\/td>\n<\/tr>\n<\/table>\n<\/div>\n<div class=\"su-tabs-pane su-u-clearfix su-u-trim\" data-title=\"Day 2\">\n<h2>DAY2 &#8211; December 13th<\/h2>\n<h3>Room : KFC Hall<\/h3>\n<h4>Plenary Session<\/h4>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time\">8:30<\/td>\n<td class=\"tbl_cell\">Registration<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">8:50<\/td>\n<td class=\"tbl_cell\">Program Outline by ISSM program Committee Chair<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">9:00<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span><br>Keynote Speech-3<br>The Path to 100 Billion Goes Upward \u2013 IBM Research Semiconductors Technology Atlas<\/span><br>\nDr.Nelson Felix, IBM\n<div class=\"chairs\">Session Chair: Yasutoshi Okuno, SCREEN Semiconductor Solutions<\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">9:40<\/td>\n<td class=\"tbl_cell\">Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">9:50<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span><br>Keynote Speech-4<br>A Requirements Driven Digital Framework to Support Semiconductor Manufacturing: Specifications and Opportunities<\/span><br>\nDr.James Moyne, AMAT \/ University of Michigan\n<div class=\"chairs\">Session Chair: Shuichi Inoue, ATONARP<\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">10:30<\/td>\n<td class=\"tbl_cell\">Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">10:40<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span><br>Keynote Speech-5<br>Heterogeneous Integration  Paving the way for Microelectronics Resurgence<\/span><br>\nMr.Timothy Lee, IEEE Board of Director<br>IEEE HIR Chair for 5G Technical Working Group\n<div class=\"chairs\">Session Chair: Kenji Miyake, PMT <\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">11:20<\/td>\n<td class=\"tbl_cell\">Sponsor Exhibition &#038; Video (Sponosr: Silver-Platinum) \/ Lunch Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">12:10<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">Keynote Speech-6<br>Decarbonization Management to Improve Corporate Value<\/span><br>\nMr.Michitaka Tokeiji, Zeroboard. Inc\n<div class=\"chairs\">Session Chair: Hiroshi Akahori, KIOXIA <\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">12:50<\/td>\n<td class=\"tbl_cell\">Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">13:00<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">AI Contest Award<\/span>\n<div class=\"chairs\">Session Co-Chairs: Shin-ichi Imai, Hitachi High-Tech \/ Isamu Namose, OMRON<\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">14:00<\/td>\n<td class=\"tbl_cell\">Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">14:10<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">3mins Flash Presentation by Interactive Poster Speakers<\/span>\n<div class=\"chairs\">Session Co-Chairs: Takanori Kawakami, JSR \/ Toshio Konishi, Toppan Photomask<\/div>\n<ul style=\"list-style:none;\">\n<li><span class=\"title_strong\">MS-57 : Data-driven Modeling for Production Dynamics<\/span><br>\nYu Sasaki, University of Tsukuba<\/li>\n<li><span class=\"title_strong\">PO-46 : Obtaining carbon nanowalls with a specified morphology<\/span><br>\nYerassyl Yerlanuly, Kazakh-British Technical University<\/li>\n<li><span class=\"title_strong\">YD-20 : Influence of High Temperature N2 Annealing on Photoluminescence  of SiC and Si Quantum Dots in SiO2 Layer<\/span><br>\nKoki Murakawa, Kanagawa University<\/li>\n<li><span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span><br>PO-59 : Experimentally study on the effect of RIE etching power on etching rate of \u03b2-Ga2O3 thin film<\/span><br>\nWang Xu, Guizhou University<\/li>\n<li><span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span><br>VD-60 : Preparation of Uniform SiO2 Insulating Layer on the Inner Wall of TSV by Thermal Oxidation<\/span><br>\nGuoFengJie, Guizhou University<\/li><\/ul><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">14:40<\/td>\n<td class=\"tbl_cell\">Sponsor Exhibition (On-site) &#038;  Break<\/td>\n<\/tr>\n<\/table>\n<hr class=\"wp-block-separator has-alpha-channel-opacity is-style-wide\"\/>\n<h3>Room 1 : KFC Hall<\/h3>\n<h4 class=\"bottom_narrow\">Session A-5: Intelligent Data Management (ID)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Masami Aoki, KLA-Tencor Japan \/ Hiroyuki Inoue, Texas Instruments Japan<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time\">15:00<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">ID-13 : Advanced Process Control Model for Trench Shape of Power Devices<\/span><br>\nTakumi Ito, TOSHIBA DEVICE &#038; STORAGE<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">15:20<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">ID-17 : Principal Component Analysis based GaN transistor live health monitoring<\/span><br>\nFlorian Chalvin, Rohm<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">15:40<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span><br>ID-27 : Application of Big Data Science in High Reliability Automotive Wafer Yield Management System and Failure Analysis<\/span><br>\nChia-Cheng Kuo, Taiwan Semiconductor Co., Ltd.<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">16:00<\/td>\n<td class=\"tbl_cell\">Author&#8217;s Interview (ON-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow\">Session A-6: Intelligent Data Management (ID)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs:Yuji Yamada, KIOXIA \/ Takayuki Hisamatsu, Sony Semiconductor Manufacturing<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time\">16:20<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">ID-32 : Equipment Sensor Data Cleansing Algorithm Design for ML-Based Anomaly Detection<\/span><br>\nShi-Chung Chang, National Taiwan University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">16:40<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">ID-26 : Dynamic AI Computation Tasks with SECS\/GEM in Semiconductor Smart Manufacturing<\/span><br>\nHung H Nguyen, Yield Engineering Systems<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">17:00<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">ID-36 : Secure and Reliable Power Monitoring for Low Consumption Factory Equipment via Programmable IoT Devices<\/span><br>\nSergio Garnica, Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">17:20<\/td>\n<td class=\"tbl_cell\"><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">17:40<\/td>\n<td class=\"tbl_cell\">Author&#8217;s Interview (ON-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<tr>\n<tr>\n<td class=\"tbl_time\">18:00<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">Poster Session (On-Site)<\/span><br><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">18:25<\/td>\n<td class=\"tbl_cell\">\n<span class=\"title_strong\">ISSM Awards<\/span><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time\">18:40<\/td>\n<td class=\"tbl_cell\"><\/td>\n<\/tr>\n<\/table>\n<hr class=\"wp-block-separator has-alpha-channel-opacity is-style-wide\"\/>\n<h3>Room2: KFC Hall Annex<\/h3>\n<h4 class=\"bottom_narrow\">Session B-5: Process Monitoring &#038; Control Method (PM)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Takahiro Tsuchiya, United Semiconductor Japan \/ Takayuki Matsumoto, United Semiconductor Japan<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_r2\">15:00<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\">PM-22 : Characterization of light propagation loss in Si Photonics using High-Resolution CDSEM metrology<\/span><br>\nShimon Halevi, Applied Materials<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">15:20<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\">PM-41 : In Situ Measurement and Analysis of Low Pressure Gas Concentration Distribution Using 70-dB SNR 1,000 Frames-per-second Absorption Imaging System<\/span><br>\nYushi Sakai, Tohoku University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">15:40<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\">PM-18 : Advanced Process Monitoring through Fault Detection and Classification for Robust Statistical Process Control of Tantalum Nitride Reactive Sputtering<\/span><br>\nStephanie Y Chang, Skyworks Solutions<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">16:00<\/td>\n<td class=\"tbl_cell_r2\">Author&#8217;s Interview (ON-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow\">Session B-6:  Process Monitoring &#038; Control Method (PM)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Shin-ichi Imai, Hitachi High-Tech \/ Tsuyoshi Moriya, Tokyo Electron<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_r2\">16:20<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\">PM-30 : Plasma Process Classification using Causal Discovery Technique<\/span><br>\nDai Kobayashi, Tokyo Electron<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">16:40<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\">PM-14 : Practical load impedance monitoring system externally installed in plasma etching equipment<\/span><br>\nYuji Kasashima, National Institute of Advanced Industrial Science and Technology<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">17:00<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\">PM-31 : Plasma diagnostics and characteristics of hydrofluorocarbon films in capacitively coupled CF4\/H2 plasmas<\/span><br>\nShih-Nan Hsiao, Nagoya University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">17:20<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\">PM-49 : A Study on Robust Noninteracting Control System Design with Disturbance Feedforward for 6-DoF AVIS<\/span><br>\nThinh Huynh, Pukyong National University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">17:40<\/td>\n<td class=\"tbl_cell_r2\">Author&#8217;s Interview (ON-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">18:00<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\">Poster Session (On-Site ONLY)<\/span><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">18:25<\/td>\n<td class=\"tbl_cell_r2\">\n<span class=\"title_strong\">ISSM Awards<\/span><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_r2\">18:40<\/td>\n<td class=\"tbl_cell_r2\"><\/td>\n<\/tr>\n<\/table>\n<\/div><\/div><\/div>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-2478","page","type-page","status-publish","hentry"],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.10 - aioseo.com -->\n\t<meta name=\"description\" content=\"Program Schedule is in JST(UTC+9) Program Schedule is s\" \/>\n\t<meta name=\"robots\" content=\"max-image-preview:large\" \/>\n\t<link rel=\"canonical\" href=\"https:\/\/issm.semiconportal.net\/2022\/program\/\" \/>\n\t<meta name=\"generator\" content=\"All in One SEO (AIOSEO) 4.9.10\" 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s\",\"inLanguage\":\"ja\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/issm.semiconportal.net\\\/2022\\\/#website\"},\"breadcrumb\":{\"@id\":\"https:\\\/\\\/issm.semiconportal.net\\\/2022\\\/program\\\/#breadcrumblist\"},\"datePublished\":\"2022-10-28T15:00:40+09:00\",\"dateModified\":\"2022-12-09T09:36:10+09:00\"},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/issm.semiconportal.net\\\/2022\\\/#website\",\"url\":\"https:\\\/\\\/issm.semiconportal.net\\\/2022\\\/\",\"name\":\"ISSM 2022\",\"description\":\"International Symposium on Semiconductor Manufacturing\",\"inLanguage\":\"ja\",\"publisher\":{\"@id\":\"https:\\\/\\\/issm.semiconportal.net\\\/2022\\\/#organization\"}}]}\n\t\t<\/script>\n\t\t<!-- All in One SEO -->\n\n","aioseo_head_json":{"title":"Program - ISSM 2022","description":"Program Schedule is in JST(UTC+9) Program Schedule is s","canonical_url":"https:\/\/issm.semiconportal.net\/2022\/program\/","robots":"max-image-preview:large","keywords":"","webmasterTools":{"miscellaneous":""},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"BreadcrumbList","@id":"https:\/\/issm.semiconportal.net\/2022\/program\/#breadcrumblist","itemListElement":[{"@type":"ListItem","@id":"https:\/\/issm.semiconportal.net\/2022#listItem","position":1,"name":"\u30db\u30fc\u30e0","item":"https:\/\/issm.semiconportal.net\/2022","nextItem":{"@type":"ListItem","@id":"https:\/\/issm.semiconportal.net\/2022\/program\/#listItem","name":"Program"}},{"@type":"ListItem","@id":"https:\/\/issm.semiconportal.net\/2022\/program\/#listItem","position":2,"name":"Program","previousItem":{"@type":"ListItem","@id":"https:\/\/issm.semiconportal.net\/2022#listItem","name":"\u30db\u30fc\u30e0"}}]},{"@type":"Organization","@id":"https:\/\/issm.semiconportal.net\/2022\/#organization","name":"ISSM \/ International Symposium on Semiconductor Manufacturing","description":"International Symposium on Semiconductor Manufacturing","url":"https:\/\/issm.semiconportal.net\/2022\/","logo":{"@type":"ImageObject","url":"http:\/\/issm.semiconportal.net\/2022\/wp-content\/uploads\/issm_logo.jpg","@id":"https:\/\/issm.semiconportal.net\/2022\/program\/#organizationLogo"},"image":{"@id":"https:\/\/issm.semiconportal.net\/2022\/program\/#organizationLogo"}},{"@type":"WebPage","@id":"https:\/\/issm.semiconportal.net\/2022\/program\/#webpage","url":"https:\/\/issm.semiconportal.net\/2022\/program\/","name":"Program - ISSM 2022","description":"Program Schedule is in JST(UTC+9) Program Schedule is s","inLanguage":"ja","isPartOf":{"@id":"https:\/\/issm.semiconportal.net\/2022\/#website"},"breadcrumb":{"@id":"https:\/\/issm.semiconportal.net\/2022\/program\/#breadcrumblist"},"datePublished":"2022-10-28T15:00:40+09:00","dateModified":"2022-12-09T09:36:10+09:00"},{"@type":"WebSite","@id":"https:\/\/issm.semiconportal.net\/2022\/#website","url":"https:\/\/issm.semiconportal.net\/2022\/","name":"ISSM 2022","description":"International Symposium on Semiconductor Manufacturing","inLanguage":"ja","publisher":{"@id":"https:\/\/issm.semiconportal.net\/2022\/#organization"}}]},"og:locale":"ja_JP","og:site_name":"ISSM 2022 - International Symposium on Semiconductor Manufacturing","og:type":"article","og:title":"Program - ISSM 2022","og:description":"Program Schedule is in JST(UTC+9) Program Schedule is s","og:url":"https:\/\/issm.semiconportal.net\/2022\/program\/","og:image":"https:\/\/issm.semiconportal.net\/2022\/wp-content\/uploads\/ISSM2022_OGP.png","og:image:secure_url":"https:\/\/issm.semiconportal.net\/2022\/wp-content\/uploads\/ISSM2022_OGP.png","article:published_time":"2022-10-28T06:00:40+00:00","article:modified_time":"2022-12-09T00:36:10+00:00","twitter:card":"summary","twitter:title":"Program - ISSM 2022","twitter:description":"Program Schedule is in JST(UTC+9) Program Schedule is s","twitter:image":"https:\/\/issm.semiconportal.net\/2022\/wp-content\/uploads\/ISSM2022_OGP.png"},"aioseo_meta_data":{"post_id":"2478","title":null,"description":null,"keywords":[],"keyphrases":{"focus":{"keyphrase":"","score":0,"analysis":{"keyphraseInTitle":{"score":0,"maxScore":9,"error":1}}},"additional":[]},"primary_term":null,"canonical_url":null,"og_title":null,"og_description":null,"og_object_type":"default","og_image_type":"default","og_image_url":null,"og_image_width":null,"og_image_height":null,"og_image_custom_url":null,"og_image_custom_fields":null,"og_video":"","og_custom_url":null,"og_article_section":null,"og_article_tags":[],"twitter_use_og":false,"twitter_card":"default","twitter_image_type":"default","twitter_image_url":null,"twitter_image_custom_url":null,"twitter_image_custom_fields":null,"twitter_title":null,"twitter_description":null,"schema":{"blockGraphs":[],"customGraphs":[],"default":{"data":{"Article":[],"Course":[],"Dataset":[],"FAQPage":[],"Movie":[],"Person":[],"Product":[],"ProductReview":[],"Car":[],"Recipe":[],"Service":[],"SoftwareApplication":[],"WebPage":[]},"graphName":"WebPage","isEnabled":true},"graphs":[]},"schema_type":"default","schema_type_options":null,"pillar_content":false,"robots_default":true,"robots_noindex":false,"robots_noarchive":false,"robots_nosnippet":false,"robots_nofollow":false,"robots_noimageindex":false,"robots_noodp":false,"robots_notranslate":false,"robots_max_snippet":"-1","robots_max_videopreview":"-1","robots_max_imagepreview":"large","priority":null,"frequency":"default","local_seo":null,"breadcrumb_settings":null,"limit_modified_date":false,"ai":null,"created":"2022-10-28 05:56:30","updated":"2025-07-15 15:15:13","seo_analyzer_scan_date":null},"aioseo_breadcrumb":"<div class=\"aioseo-breadcrumbs\"><span class=\"aioseo-breadcrumb\">\n\t\t\t<a href=\"https:\/\/issm.semiconportal.net\/2022\" title=\"\u30db\u30fc\u30e0\">\u30db\u30fc\u30e0<\/a>\n\t\t<\/span><span class=\"aioseo-breadcrumb-separator\">\u00bb<\/span><span 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