{"id":1725,"date":"2022-02-24T11:49:19","date_gmt":"2022-02-24T02:49:19","guid":{"rendered":"https:\/\/issm.semiconportal.net\/2024\/?page_id=1725"},"modified":"2024-12-04T18:09:53","modified_gmt":"2024-12-04T09:09:53","slug":"organization","status":"publish","type":"page","link":"https:\/\/issm.semiconportal.net\/2024\/organization\/","title":{"rendered":"Organization"},"content":{"rendered":"\n

Organizing Committee<\/h2>\n\n\n\n
\n
Chairman<\/dt>\n
Shozo Saito, Nippon Electronic Device Industry Association(NEDIA)<\/dd>\n
Vice Chairman<\/dt>\n
Shuichi Inoue, ATONARP INC.<\/dd>\n
Member<\/dt>\nJunichi Wada, KIOXIA Corporation
\nMasayoshi Tarutani, Mitsubishi Electric Corporation
\nMichihiro Inoue, National Institute of Advanced Industrial Science and Technology (AIST)
\nAtsuyoshi Koike, Rapidus Corporation
\nYasutoshi Okuno, SCREEN Holdings Co., Ltd.
\nHayato Iwamoto, Sony Semiconductor Solutions Corporation
\nSumie Segawa, Tokyo Electron Ltd.
\nHiroaki Kato, TOSHIBA ELECTRONIC DEVICES & STORAGE Corporation
\nTomoyuki Sasaki, Tower Partners Semiconductor Co., Ltd.<\/dd>\n<\/dl>\n\n\n\n

Executive Committee<\/h2>\n\n\n\n
\n
Chairman<\/dt>\n
Ayako Shimazaki, Toshiba Nanoanalysis Corporation<\/dd>\n
Treasurer<\/dt>\n
Hiroaki Kato, TOSHIBA ELECTRONIC DEVICES & STORAGE Corporation<\/dd>\n
Member<\/dt>\n
Kensuke Uriga, Dura Systems, Inc.
\nTakeshi Hattori, Hattori Consulting International
\nSuigen Kyoh, Kioxia Corporation
\nToshiyuki Uchino, formerly Kokusai Electric Corporation
\nMasayoshi Tarutani, Mitsubishi Electric Corporation
\nHiroyuki Chuma, Nisshinbo Holdings Inc.
\nKatsutoshi Ozawa, OMRON Corporation
\nKazuya Okamoto, Osaka University \/ Nippon Institute of Technology
\nHiroyuki Mori, Renesas Electronics Corporation
\nTakashi Shimane, Rohm Co., Ltd.
\nYasutoshi Okuno, SCREEN Holdings Co., Ltd.
\nHiroshi Akahori, Rapidus Corporation
\nMasahiko Hamajima, SEMI
\nKiyoshi Watanabe, Semiconductor Equipment Association of Japan (SEAJ)
\nHayato Iwamoto, Sony Semiconductor Solutions Corporation
\nTsuyoshi Moriya, Tokyo Electron, Ltd.
\nTomoyuki Sasaki, Tower Partners Semiconductor Co., Ltd.<\/dd>\n<\/dl>\n\n\n\n

Program Committee<\/h2>\n\n\n\n
\n
Chairman<\/dt>\n
Shin-ichi Imai, Hitachi High-Tech Corporation<\/dd>\n
Executive Vice Chairman<\/dt>\n
Ayako Shimazaki, Toshiba Nanoanalysis Corporation<\/dd>\n
Committee leader<\/dt>\n
Kazunori Kato, Advanced Interface Technology Corporation
\nIsamu Namose, OMRON Corporation
\nKazuhito Matsukawa, SUMCO Corporation
\nYuki Yamada, JX Advanced Metals<\/dd>\n
ISSM Conference Editor for IEEE TSM<\/dt>\n
Tsuyoshi Moriya, Tokyo Electron Ltd.<\/dd>\n
Member<\/dt>\n
Shinsuke Mizuno, Applied Materials Japan, Inc
\nSatoko Nakagawa, GlobalWafers Japan Co., Ltd
\nKazunori Nemoto, Hitachi High Technologies America, Inc.
\nMasahiro Shimbo, JS Foundry Co., Ltd
\nMinoru Inomoto, KIOXIA Corporation
\nMasami Aoki, KLA-Tencor Japan Ltd.
\nYoon Sung Min, Kyung Hee University
\nKenji Miyake, Office Miyake
\nKazuki Yokota, Renesas Electronics Corporation
\nShoji Takei, Rohm Co., Ltd.
\nKenji Watanabe, Rapidus Corporation
\nTakayuki Hisamatsu, Sony Semiconductor Manufacturing Corporation
\nHiroyuki Inoue, Texas Instruments Japan Limited
\nShun-ichiro Ohmi, Institute of Science Tokyo
\nToshio Konishi, Tekscend Photomask Corp.
\nTakatoshi Yasui, Tower Partners Semiconductor Co., Ltd.
\nTakayuki Matsumoto, United Semiconductor Japan Co., Ltd.
\nSumika Arima, University of Tsukuba<\/dd>\n<\/dl>\n\n\n\n
e-Manufacturing & Design Collaboration Conference (eMDC) Advisory Committee<\/h5>\n\n\n\n

Dr. Nicky C.C. Lu, Etron Technology, Inc.
Dr. TY Wu, TSIA
Ms. Celia Shih, TSIA
Mr. Thomas Chen, tsmc
Mr. Robert Chien, tsmc
Dr. C. Hsu, tsmc
Prof. SC Chang, National Taiwan University<\/p>\n","protected":false},"excerpt":{"rendered":"

Organizing Committee Chairman Shozo Saito, Nippon Electronic Device Industry Association(NEDIA) Vice Chairman … \u7d9a\u304d\u3092\u8aad\u3080 Organization<\/span> →<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-1725","page","type-page","status-publish","hentry"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/pages\/1725","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/comments?post=1725"}],"version-history":[{"count":27,"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/pages\/1725\/revisions"}],"predecessor-version":[{"id":3731,"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/pages\/1725\/revisions\/3731"}],"wp:attachment":[{"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/media?parent=1725"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}