{"id":1729,"date":"2022-02-24T12:21:33","date_gmt":"2022-02-24T03:21:33","guid":{"rendered":"https:\/\/issm.semiconportal.net\/2024\/?page_id=1729"},"modified":"2024-12-05T12:16:17","modified_gmt":"2024-12-05T03:16:17","slug":"about-issm","status":"publish","type":"page","link":"https:\/\/issm.semiconportal.net\/2024\/about-issm\/","title":{"rendered":"About ISSM"},"content":{"rendered":"\n<h2 class=\"wp-block-heading\">ISSM HISTORY<\/h2>\n\n\n\n<p>ISSM\u2019s mission is to achieve the continued prosperity of the semiconductor industry by bringing about breakthroughs in semiconductor manufacturing technologies through networking between engineers in research and development fields and their counterparts in the manufacturing field.<\/p>\n\n\n\n<table id=\"tablepress-1\" class=\"tablepress tablepress-id-1\">\n<tbody>\n<tr class=\"row-1\">\n\t<td class=\"column-1\">2024<\/td><td class=\"column-2\">30th<\/td><td class=\"column-3\">ISSM 2024<br \/>\nKFC Hall, Tokyo Japan<br \/>\nDecember 9-10, 2024<\/td>\n<\/tr>\n<tr class=\"row-2\">\n\t<td class=\"column-1\">2022<\/td><td class=\"column-2\">29th<\/td><td class=\"column-3\"><a href=\"https:\/\/issm.semiconportal.net\/2022\/\" rel=\"noopener nofollow\" target=\"_blank\">ISSM 2022<\/a><br \/>\nKFC Hall, Tokyo Japan<br \/>\nDecember 12-13, 2022<\/td>\n<\/tr>\n<tr class=\"row-3\">\n\t<td class=\"column-1\">2021<\/td><td class=\"column-2\"><\/td><td class=\"column-3\">Cancelled<\/td>\n<\/tr>\n<tr class=\"row-4\">\n\t<td class=\"column-1\">2020<\/td><td class=\"column-2\">28th<\/td><td class=\"column-3\"><a href=\"https:\/\/www.semiconportal.com\/issm\/index.html\" rel=\"noopener nofollow\" target=\"_blank\">ISSM2020<\/a><br \/>\nVirtual Symposium<br \/>\nDecember 15-16, 2020<\/td>\n<\/tr>\n<tr class=\"row-5\">\n\t<td class=\"column-1\">2019<\/td><td class=\"column-2\">27th<\/td><td class=\"column-3\"><a href=\"https:\/\/www.tsia.org.tw\/seminar\/eManufacturing2019\/\" rel=\"noopener nofollow\" target=\"_blank\">e-Manufacturing &amp; Design Collaboration Symposium -A Joint Symposium with ISSM 2019<\/a><br \/>\nThe Ambassador Hotel Hsin Chu, Taiwan<br \/>\n6-Sep-19<\/td>\n<\/tr>\n<tr class=\"row-6\">\n\t<td class=\"column-1\">2018<\/td><td class=\"column-2\">26th<\/td><td class=\"column-3\"><a href=\"https:\/\/www.semiconportal.com\/issm\/2018\/\" rel=\"noopener nofollow\" target=\"_blank\">ISSM 2018<\/a>KFC Hall, Tokyo Japan<br \/>\nDecember 10-11, 2018<\/td>\n<\/tr>\n<tr class=\"row-7\">\n\t<td class=\"column-1\">2017<\/td><td class=\"column-2\">25th<\/td><td class=\"column-3\"><a href=\"http:\/\/www.digicraft.com.tw\/tsia2017\/index.asp\" rel=\"noopener nofollow\" target=\"_blank\">e-Manufacturing &amp; Design Collaboration Symposium -A Joint Symposium with ISSM 2017<\/a><br \/>\nThe Ambassador Hotel Hsin Chu, Taiwan<br \/>\nSeptember 9, 2017<\/td>\n<\/tr>\n<tr class=\"row-8\">\n\t<td class=\"column-1\">2016<\/td><td class=\"column-2\">24th<\/td><td class=\"column-3\"><a href=\"https:\/\/www.semiconportal.com\/issm\/2016\/\" rel=\"noopener nofollow\" target=\"_blank\">ISSM 2016<\/a><br \/>\nKFC Hall, Tokyo Japan<br \/>\nDecember 12-13, 2016<\/td>\n<\/tr>\n<tr class=\"row-9\">\n\t<td class=\"column-1\">2015<\/td><td class=\"column-2\">23th<\/td><td class=\"column-3\"><a href=\"http:\/\/www.digicraft.com.tw\/tsia2015\/callforpaper.html\" rel=\"noopener nofollow\" target=\"_blank\">e-Manufacturing &amp; Design Collaboration Symposium -A Joint Symposium with ISSM 2015<\/a><br \/>\nTaipei World Trade Center Nangang Exhibition Hall<br \/>\nSeptember 2-3, 2015<\/td>\n<\/tr>\n<tr class=\"row-10\">\n\t<td class=\"column-1\">2014<\/td><td class=\"column-2\">22th<\/td><td class=\"column-3\"><a href=\"https:\/\/www.semiconportal.com\/issm\/2014\/\" rel=\"noopener nofollow\" target=\"_blank\">ISSM 2014<\/a><br \/>\nHyatt Regency Tokyo, Tokyo, Japan<br \/>\nDecember 2-3, 2014<\/td>\n<\/tr>\n<tr class=\"row-11\">\n\t<td class=\"column-1\">2013<\/td><td class=\"column-2\">21th<\/td><td class=\"column-3\"><a href=\"http:\/\/www.tsia.org.tw\/seminar\/eManufacturing2013\/\" rel=\"noopener nofollow\" target=\"_blank\">e-Manufacturing &amp; Design Collaboration Symposium -A Joint Symposium with ISSM 2013<\/a><br \/>\nThe Ambassador Hotel Hsin Chu, Taiwan<\/td>\n<\/tr>\n<tr class=\"row-12\">\n\t<td class=\"column-1\">2012<\/td><td class=\"column-2\">20th<\/td><td class=\"column-3\"><a href=\"https:\/\/www.semiconportal.com\/issm\/2012\/\" rel=\"noopener nofollow\" target=\"_blank\">ISSM 2012<\/a><br \/>\nHyatt Regency Tokyo, Tokyo, Japan<br \/>\nOctober 15-17, 2012<\/td>\n<\/tr>\n<tr class=\"row-13\">\n\t<td class=\"column-1\">2011<\/td><td class=\"column-2\">19th<\/td><td class=\"column-3\"><a href=\"http:\/\/www.tsia.org.tw\/seminar\/eManufacturing2010\/\" rel=\"noopener nofollow\" target=\"_blank\">e-Manufacturing &amp; Design Collaboration Symposium -A Joint Symposium with ISSM 2011<\/a><br \/>\nThe Ambassador Hotel Hsin Chu, Taiwan<br \/>\nSeptember 5-6, 2011<\/td>\n<\/tr>\n<tr class=\"row-14\">\n\t<td class=\"column-1\">2010<\/td><td class=\"column-2\">18th<\/td><td class=\"column-3\"><a href=\"https:\/\/www.semiconportal.com\/issm\/2010\/\" rel=\"noopener nofollow\" target=\"_blank\">ISSM 2010<\/a><br \/>\nHyatt Regency Tokyo, Tokyo, Japan<br \/>\nOctober 18-20, 2010<\/td>\n<\/tr>\n<tr class=\"row-15\">\n\t<td class=\"column-1\">2009<\/td><td class=\"column-2\"><\/td><td class=\"column-3\">Cancelled<\/td>\n<\/tr>\n<tr class=\"row-16\">\n\t<td class=\"column-1\">2008<\/td><td class=\"column-2\">17th<\/td><td class=\"column-3\">ISSM 2008<br \/>\nHyatt Regency Tokyo, Tokyo, Japan<br \/>\nOctober 27-29, 2008<\/td>\n<\/tr>\n<tr class=\"row-17\">\n\t<td class=\"column-1\">2007<\/td><td class=\"column-2\">16th<\/td><td class=\"column-3\">ISSM 2007<br \/>\nMarriott Hotel, Santa Clara, California USA<br \/>\nOctober 15-17, 2007<\/td>\n<\/tr>\n<tr class=\"row-18\">\n\t<td class=\"column-1\">2006<\/td><td class=\"column-2\">15th<\/td><td class=\"column-3\">ISSM 2006<br \/>\nHyatt Regency Tokyo, Tokyo, Japan<br \/>\nSeptember 25-27, 2006<\/td>\n<\/tr>\n<tr class=\"row-19\">\n\t<td class=\"column-1\">2005<\/td><td class=\"column-2\">14th<\/td><td class=\"column-3\">ISSM 2005<br \/>\nFairmont Hotel, San Jose, California, USA<br \/>\nSeptember 13-15, 2005<\/td>\n<\/tr>\n<tr class=\"row-20\">\n\t<td class=\"column-1\">2004<\/td><td class=\"column-2\">13th<\/td><td class=\"column-3\">ISSM 2004<br \/>\nKeio Plaza Hotel, Tokyo, Japan<br \/>\nSeptember 27-29, 2004<\/td>\n<\/tr>\n<tr class=\"row-21\">\n\t<td class=\"column-1\">2003<\/td><td class=\"column-2\">12th<\/td><td class=\"column-3\">ISSM 2003<br \/>\nSan Jose, California, USA<br \/>\nSeptember 30 \u2013 October 2, 2003<\/td>\n<\/tr>\n<tr class=\"row-22\">\n\t<td class=\"column-1\">2002<\/td><td class=\"column-2\">11th<\/td><td class=\"column-3\">ISSM 2002<br \/>\nOctober 15-17,2002<br \/>\nJapan<\/td>\n<\/tr>\n<tr class=\"row-23\">\n\t<td class=\"column-1\">2001<\/td><td class=\"column-2\">10th<\/td><td class=\"column-3\">ISSM 2001<br \/>\nSanJose,California, USA<br \/>\nOctober 8-10, 2001<\/td>\n<\/tr>\n<tr class=\"row-24\">\n\t<td class=\"column-1\">2000<\/td><td class=\"column-2\">9th<\/td><td class=\"column-3\">ISSM 2000<br \/>\nSeptember 26-28, 2000<br \/>\nToshi Center Hotel, Tokyo, Japan<br \/>\nZenkoku Toshi Kaikan, Tokyo, Japan<\/td>\n<\/tr>\n<tr class=\"row-25\">\n\t<td class=\"column-1\">1999<\/td><td class=\"column-2\">8th<\/td><td class=\"column-3\"><\/td>\n<\/tr>\n<tr class=\"row-26\">\n\t<td class=\"column-1\">1998<\/td><td class=\"column-2\">7th<\/td><td class=\"column-3\">ISSM1998<br \/>\nHotel East 21 Tokyo, Tokyo, Japan<br \/>\nOctober 7-9, 1998<\/td>\n<\/tr>\n<tr class=\"row-27\">\n\t<td class=\"column-1\">1997<\/td><td class=\"column-2\">6th<\/td><td class=\"column-3\"><\/td>\n<\/tr>\n<tr class=\"row-28\">\n\t<td class=\"column-1\">1996<\/td><td class=\"column-2\">5th<\/td><td class=\"column-3\">ISSM 1996<br \/>\nHotel East 21 Tokyo, Tokyo, Japan<br \/>\nOctober 2-4, 1996<\/td>\n<\/tr>\n<tr class=\"row-29\">\n\t<td class=\"column-1\">1995<\/td><td class=\"column-2\">4th<\/td><td class=\"column-3\">ISSM 1995<br \/>\nAustin, Texas, USA<br \/>\nSeptember 17-19, 1995<\/td>\n<\/tr>\n<tr class=\"row-30\">\n\t<td class=\"column-1\">1994<\/td><td class=\"column-2\">3rd<\/td><td class=\"column-3\">ISSM 1994<br \/>\nTOSHO HALL<br \/>\nJune 21-22, 1994<\/td>\n<\/tr>\n<tr class=\"row-31\">\n\t<td class=\"column-1\">1993<\/td><td class=\"column-2\">2nd<\/td><td class=\"column-3\">Austin, Texas, USA<br \/>\nSeptember 20-21, 1993<\/td>\n<\/tr>\n<tr class=\"row-32\">\n\t<td class=\"column-1\">1992<\/td><td class=\"column-2\">1st<\/td><td class=\"column-3\">ISSM 1992<br \/>\nThe Hotel New Otani, Tokyo, Japan<br \/>\nMay 14-15, 1992<\/td>\n<\/tr>\n<\/tbody>\n<\/table>\n\n\n\n\n<h2 class=\"wp-block-heading\">ISSM BACKGROUND<\/h2>\n\n\n\n<p>The semiconductor industry has brought about a dramatic transformation to society in the half century since the invention of the transistor. In much the same way as the revolution that brought transistors to integrated circuits, the system LSI is a concept that will bring a paradigm shift that will impact across the global semiconductor, IT and electronics related industries. With the advent of the system LSI, in addition to the importance of scaling rules based technology development, it is now essential to establish a new scheme for semiconductor manufacturing technologies in order to meet requirements for system LSIs as technologies for a ubiquitous network society.<\/p>\n\n\n\n<p>The semiconductor industry is going through a big transition to meet this change. As an industry heavily dependent on its manufacturing capability and productivity, the industry is shifting from an integrated device manufacturing model to more horizontal specialized manufacturing processes, as well as pursuing manufacturing cost reductions with 300mm wafer transition, a step-by-step investment approach, and the introduction of customized, small\/medium quantity production methods. The key words for competitive SoC manufacturing technologies are high quality, low cost, and high efficiency. Furthermore, environmental considerations are also becoming an important consideration for semiconductor manufacturing processes.<\/p>\n\n\n\n<p>Semiconductor manufacturing technology is reliant on the sum of the total of engineers\u2019 experiences and the accumulation of know-how and IP. The complexity of the field prevents a shift to the systematization and universalization of technologies. In order to bring breakthroughs in semiconductor manufacturing to reflect changing and challenging new requirements, the International Symposium on Semiconductor Manufacturing (ISSM) was launched in 1992.<\/p>\n\n\n\n<p>ISSM is an annual conference of semiconductor manufacturing professionals dedicated to sharing technical solutions and opinions on the advancement of manufacturing science, technologies, and management disciplines. ISSM aims to establish new concepts for semiconductor manufacturing technologies and to promote them as systemized and universalized technologies. ISSM\u2019s role has been to challenge the concept of shifting from \u201cknow-how\u201d to \u201cscience\u201d in semiconductor manufacturing technologies. The past twelve annual symposia have helped to shape the course of development of \u201cmanufacturing science,\u201d as well as to create new manufacturing technologies.<\/p>\n\n\n\n<p>The Symposium is held under the joint sponsorship of the Society of Applied Physics of Japan, the IEEE Electron Devices Society, Semiconductor Equipment and Materials International (SEMI), and Taiwan Semiconductor Industry Association (TSIA). ISSM, with its global range, continuously pushes technological development in order to promote the discovery and utilization of innovative technologies. ISSM\u2019s mission is to achieve the continued prosperity of the semiconductor industry by bringing about breakthroughs in semiconductor manufacturing technologies through networking between engineers in research and development fields and their counterparts in the manufacturing field.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>ISSM Sponsors<\/strong><\/h2>\n\n\n\n<p>Co Sponsored by: IEEE Electron Devices Society, MINIMAL(Minimal Fab Promoting Organization)<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"191\" height=\"100\" src=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM_co-sponsors-1.gif\" alt=\"\" class=\"wp-image-2728\"\/><\/figure>\n\n\n\n<h2 class=\"wp-block-heading\"><strong>ISSM Supporters<\/strong><\/h2>\n\n\n\n<p>Supported by Semiconductor Equipment Association of Japan (SEAJ),Semiconductor Equipment and Materials International (SEMI) and Taiwan Semiconductor Industry Association (TSIA)<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"350\" height=\"100\" src=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM_Supporters-1.gif\" alt=\"\" class=\"wp-image-2730\"\/><\/figure>\n\n\n\n<p>Endorsement by The Japan Society of Applied Physics<\/p>\n\n\n\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"70\" height=\"70\" src=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM_Endorsement-1.gif\" alt=\"Japan Society of Applied Physics\" class=\"wp-image-2729\"\/><\/figure>\n\n\n\n<h5 class=\"wp-block-heading\">In conjunction with<\/h5>\n\n\n\n<ul class=\"wp-block-list\">\n<li class=\"link-exit\"><a href=\"https:\/\/ewh.ieee.org\/conf\/edtm\/\" target=\"_blank\" rel=\"noopener\" title=\"\">Electron Devices Technology and Manufacturing (EDTM)<\/a><\/li>\n\n\n\n<li class=\"link-exit\"><a href=\"https:\/\/iitc-conference.org\/\" target=\"_blank\" rel=\"noopener\" title=\"\">International Interconnect Technology Conference (IITC)<\/a><\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p>ISSM HISTORY ISSM\u2019s mission is to achieve the continued prosperity of the semiconductor industry by bringing a &hellip; <a href=\"https:\/\/issm.semiconportal.net\/2024\/about-issm\/\" class=\"more-link\">\u7d9a\u304d\u3092\u8aad\u3080 <span class=\"screen-reader-text\">About ISSM<\/span> <span class=\"meta-nav\">&rarr;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-1729","page","type-page","status-publish","hentry"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/pages\/1729","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/comments?post=1729"}],"version-history":[{"count":14,"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/pages\/1729\/revisions"}],"predecessor-version":[{"id":3748,"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/pages\/1729\/revisions\/3748"}],"wp:attachment":[{"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/media?parent=1729"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}