{"id":2739,"date":"2024-03-19T13:12:33","date_gmt":"2024-03-19T04:12:33","guid":{"rendered":"https:\/\/issm.semiconportal.net\/2024\/?page_id=2739"},"modified":"2024-12-16T17:32:24","modified_gmt":"2024-12-16T08:32:24","slug":"issm-2024","status":"publish","type":"page","link":"https:\/\/issm.semiconportal.net\/2024\/","title":{"rendered":"ISSM 2024"},"content":{"rendered":"\n<h4 class=\"wp-block-heading mb-30\">International Symposium on Semiconductor Manufacturing 2024<\/h4>\n\n\n\n<div style=\"height:20px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<p class=\"wp-block-paragraph\">The International Symposium on Semiconductor Manufacturing (ISSM) is a premier conference for semiconductor manufacturing professionals dedicated to sharing technical solutions and opinions on the advancement of manufacturing science, technologies, and management disciplines. Since its start in 1992 in Japan, ISSM has been providing unique opportunities to share semiconductor manufacturing technology\u201d, best practices\u201d for the benefit of professionals worldwide.<br>ISSM aims to establish new concepts for semiconductor manufacturing technologies and to promote them as systemized and universalized technologies. ISSM brings together researchers and engineers involved in semiconductor manufacturing technology from a wide range of industries and universities,<br>The two-day symposium includes keynote speeches, tutorial speeches, semiconductor manufacturing technologies sessions, interactive poster sessions, and supplier exhibits.<br>This year, ISSM will celebrates its 30th anniversary. Join us and share the knowledge among the participants.<\/p>\n\n\n\n<h2 class=\"wp-block-heading\">ISSM 2024 Awards<\/h2>\n\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"866\" height=\"498\" src=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Bestpaper_Award.png\" alt=\"ISSM 2024 award winners\" class=\"wp-image-3769\" srcset=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Bestpaper_Award.png 866w, https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Bestpaper_Award-300x173.png 300w, https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Bestpaper_Award-768x442.png 768w\" sizes=\"auto, (max-width: 866px) 100vw, 866px\" \/><\/figure>\n<\/div>\n\n<div class=\"wp-block-image\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"784\" height=\"800\" src=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_BestPapers.png\" alt=\"ISSM 2024 Best Papers\" class=\"wp-image-3772\" srcset=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_BestPapers.png 784w, https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_BestPapers-294x300.png 294w, https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_BestPapers-768x784.png 768w\" sizes=\"auto, (max-width: 784px) 100vw, 784px\" \/><\/figure>\n<\/div>\n\n\n<div class=\"wp-block-columns bottom_narrow is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"430\" height=\"343\" src=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Best_Student.png\" alt=\"\" class=\"wp-image-3778\" srcset=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Best_Student.png 430w, https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Best_Student-300x239.png 300w\" sizes=\"auto, (max-width: 430px) 100vw, 430px\" \/><\/figure>\n<\/div>\n\n\n\n<div class=\"wp-block-column is-layout-flow wp-block-column-is-layout-flow\">\n<figure class=\"wp-block-image size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"430\" height=\"343\" src=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Best_Student_Poster.png\" alt=\"\" class=\"wp-image-3777\" srcset=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Best_Student_Poster.png 430w, https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Best_Student_Poster-300x239.png 300w\" sizes=\"auto, (max-width: 430px) 100vw, 430px\" \/><\/figure>\n<\/div>\n<\/div>\n\n\n<div class=\"wp-block-image top_narrow\">\n<figure class=\"aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"784\" height=\"176\" src=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_student_awards.png\" alt=\"\" class=\"wp-image-3779\" srcset=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_student_awards.png 784w, https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_student_awards-300x67.png 300w, https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_student_awards-768x172.png 768w\" sizes=\"auto, (max-width: 784px) 100vw, 784px\" \/><\/figure>\n<\/div>\n\n\n<div style=\"height:20px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">What\u2019s New<\/h2>\n\n\n\n<ul class=\"wp-block-list\">\n<li>December 6, 2024 &#8211; For registrants, the proceedings will be distributed at 8:00am on December 9th, 2024.<br>And online access will also be provided to all registrants, including those who register as &#8221; In-Person (on-site) &#8220;.<\/li>\n\n\n\n<li>December 6,2024 &#8211; <a class=\"pdf\" href=\"https:\/\/www.semiconportal.com\/dl\/ISSM2024\/ISSM2024_Program_Book.pdf\" target=\"_blank\" rel=\"noopener\">ISSM2024 Program Book including abstracts of technical papers is available<\/a>.<\/li>\n\n\n\n<li>December 2, 2024 &#8211; Speaker Information has been sent to the authors on November 29th, 2024. If you have not received, visit the URL below<br>&#8211; <a href=\"https:\/\/issm.semiconportal.net\/2024\/oral-presenter\/\" title=\"Oral Presenter\">Oral Presenter<\/a><br>&#8211; <a href=\"https:\/\/issm.semiconportal.net\/2024\/poster-presenter\/\" title=\"Poster Presenter\">Poster Presenter<\/a><\/li>\n\n\n\n<li>November 6, 2024 &#8211; <a href=\"https:\/\/issm.semiconportal.net\/2024\/program\/\" title=\"Program\">ISSM2024 Program schedule is now released.<\/a><\/li>\n\n\n\n<li>October 9, 2024 &#8211; <a href=\"\/registration\/\">Early Bird Registration is available through November 21, 2024<\/a><\/li>\n\n\n\n<li>October 4, 2024 &#8211; <a href=\"\/authors\/\" title=\"\">Accepted Authors guideline is available. For the authors, please check the page.<\/a><\/li>\n\n\n\n<li>October 4, 2024 &#8211; Notification of Paper Acceptance has been sent to authors today.<\/li>\n\n\n\n<li>August 22, 2024 &#8211; <a href=\"https:\/\/issm.semiconportal.net\/2024\/keynote-speakers\/\" title=\"Keynote Speakers\">Keynote Speakers information is now available<\/a><\/li>\n\n\n\n<li>July 29, 2024 &#8211; The paper submission due date has been extended to August 23, 2024.<\/li>\n\n\n\n<li>June 10, 2024 &#8211; <a href=\"\/tutorial-speakers\/\" title=\"\">Tutorial Speaker information is now available<\/a><\/li>\n\n\n\n<li>May 17, 2024 &#8211; <a href=\"\/cfp\/\" title=\"\">Announcement<\/a> of call-for-paper is available. Submission due is July 29, 2024.<\/li>\n<\/ul>\n\n\n\n<div style=\"height:59px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">Important Dates<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\"><span class=\"bold\">ISSM2024:<\/span> Monday, December 9th \u2013 Tuesday, December 10th<\/p>\n\n\n\n<p class=\"wp-block-paragraph\"><span class=\"bold\">Full paper submission due:<\/span> November&nbsp;18, 2024<br>\n    <span class=\"bold\">Copyright form submission due:<\/span> November 18, 2024<br>\n    <span class=\"bold\">Presentation date submission due:<\/span> December 2, 2024<br>\n    <span class=\"bold\">Abstract Submission Start:<\/span> end of May 2024<br>\n    <span class=\"bold\">[Extended] Abstract Submission Due:<\/span> <s>Mon., Jul. 29, 2024<\/s>&nbsp;Sep. 13, 2024<br>\n    <span class=\"bold\">[Extended] Notification of Paper Acceptance:<\/span> <s>Fri., Sept. 20, 2024<\/s>&nbsp;Fri., Oct. 4, 2024<\/p>\n\n\n\n<div style=\"height:59px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<h2 class=\"wp-block-heading\">ISSM 2024 Sponsorship Opportunities<\/h2>\n\n\n\n<p class=\"wp-block-paragraph\">If you are interested in ISSM sponsorship, please email the application form to the secretariat.<br>The application form can be downloaded from below.<\/p>\n\n\n\n<ul class=\"wp-block-list\">\n<li class=\"link-pdf\"><a href=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Sponsorship_Prospectus_English_Ver5_0.pdf\" target=\"_blank\" rel=\"noopener\" title=\"\">ISSM Sponsorship Information (English)<\/a><\/li>\n\n\n\n<li class=\"link-word\"><a href=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Sponsorship_Application_Form_English_V1.docx\" target=\"_blank\" rel=\"noopener\" title=\"\">ISSM Sponsorship Application Form (English)<\/a><\/li>\n\n\n\n<li class=\"link-pdf\"><a href=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Sponsorship_Prospectus_Japanese_Ver7_0.pdf\" target=\"_blank\" rel=\"noopener\" title=\"\">ISSM Sponsorship Information (Japanese)<\/a><\/li>\n\n\n\n<li class=\"link-word\"><a href=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Sponsorship_Application_Form_Japanese.docx\" target=\"_blank\" rel=\"noopener\" title=\"\">ISSM Sponsorship Application Form (Japanese)<\/a><\/li>\n<\/ul>\n\n\n\n<div style=\"height:59px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<p class=\"wp-block-paragraph\">Contact to <a href=\"mailto:issm_2024@semiconportal.com\">issm_2024@semiconportal.com<\/a> for further inquiries.<\/p>\n","protected":false},"excerpt":{"rendered":"<p>International Symposium on Semiconductor Manufacturing 2024 The International Symposium on Semiconductor Manuf &hellip; <a href=\"https:\/\/issm.semiconportal.net\/2024\/\" class=\"more-link\">\u7d9a\u304d\u3092\u8aad\u3080 <span class=\"screen-reader-text\">ISSM 2024<\/span> <span class=\"meta-nav\">&rarr;<\/span><\/a><\/p>\n","protected":false},"author":2,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-2739","page","type-page","status-publish","hentry"],"aioseo_notices":[],"_links":{"self":[{"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/pages\/2739","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/comments?post=2739"}],"version-history":[{"count":25,"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/pages\/2739\/revisions"}],"predecessor-version":[{"id":3781,"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/pages\/2739\/revisions\/3781"}],"wp:attachment":[{"href":"https:\/\/issm.semiconportal.net\/2024\/wp-json\/wp\/v2\/media?parent=2739"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}