{"id":2818,"date":"2024-04-16T11:13:58","date_gmt":"2024-04-16T02:13:58","guid":{"rendered":"https:\/\/issm.semiconportal.net\/2024\/?page_id=2818"},"modified":"2024-12-06T15:21:00","modified_gmt":"2024-12-06T06:21:00","slug":"program","status":"publish","type":"page","link":"https:\/\/issm.semiconportal.net\/2024\/program\/","title":{"rendered":"Program"},"content":{"rendered":"\n<ul class=\"wp-block-list top_narrow\">\n<li>Program Schedule is in JST(UTC+9)<\/li>\n\n\n\n<li>Program Schedule is subject to change<\/li>\n<\/ul>\n\n\n\n<ul class=\"wp-block-list\">\n<li class=\"pr\"><a href=\"https:\/\/www.semiconportal.com\/dl\/ISSM2024\/ISSM2024_Program_Book.pdf\" target=\"_blank\" rel=\"noopener\">Program Book<\/a><\/li>\n\n\n\n<li class=\"pr\"><a href=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024-Final-Program_At-a-glance_V14r.pdf\" target=\"_blank\" rel=\"noopener\">Program At-a-glance<\/a><\/li>\n<\/ul>\n\n\n\n<div class=\"wp-block-columns is-layout-flex wp-container-core-columns-is-layout-8f761849 wp-block-columns-is-layout-flex\">\n<div class=\"wp-block-column is-vertically-aligned-bottom is-layout-flow wp-block-column-is-layout-flow\">\n<!--\n<figure class=\"wp-block-image aligncenter size-full\"><img loading=\"lazy\" decoding=\"async\" width=\"336\" height=\"436\" src=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Program_At-a-glance.png\" alt=\"\" class=\"wp-image-3656\" srcset=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Program_At-a-glance.png 336w, https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024_Program_At-a-glance-231x300.png 231w\" sizes=\"auto, (max-width: 336px) 100vw, 336px\" \/><figcaption class=\"wp-element-caption\"><strong><a href=\"https:\/\/issm.semiconportal.net\/2024\/wp-content\/uploads\/sites\/4\/ISSM2024-Final-Program_At-a-glance_V14r.pdf\" target=\"_blank\" rel=\"noopener\" title=\"\">Click here to the program at-a-glance in PDF<\/a><\/strong><\/figcaption><\/figure>\n-->\n<\/div>\n<\/div>\n\n\n\n<div class=\"su-tabs su-tabs-style-default su-tabs-mobile-stack\" data-active=\"1\" data-scroll-offset=\"0\" data-anchor-in-url=\"no\"><div class=\"su-tabs-nav\"><span class=\"\" data-url=\"\" data-target=\"blank\" tabindex=\"0\" role=\"button\">Day 1<\/span><span class=\"\" data-url=\"\" data-target=\"blank\" tabindex=\"0\" role=\"button\">Day 2<\/span><\/div><div class=\"su-tabs-panes\"><div class=\"su-tabs-pane su-u-clearfix su-u-trim\" data-title=\"Day 1\">\n<h2>DAY1 &#8211; December 9<\/h2>\n<h3 class=\"room1\">Room A : KFC Hall<\/h3>\n<h4>Plenary Session<\/h4>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_room1\">8:15<\/td>\n<td class=\"tbl_cell_room1\">Registration<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">9:00<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">Opening<br>Opening Remarks Conference OutlineProgram Schedule<\/span><br>\nShozo Saito, ISSM Organizing Committee Chair<br>Ayako Shimazaki, ISSM Executive Committee Chair<br>Shin-ichi Imai, ISSM Program Committee Chair\n<div class=\"chairs\">MC: Shuichi Inoue, ATONARP Inc.<\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">9:10<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">Tutorial Speech-1<br>50 years of thin film processing innovation in SC industry<\/span><br>\nProf. Christophe Vall\u00e9e, University at Albany, CNSE\n<div class=\"chairs\">Session Chair: Tsuyoshi Moriya, Tokyo Electron<\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">9:40<\/td>\n<td class=\"tbl_cell_room1\">Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">9:45<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">Tutorial Speech-2<br>Computational materials science studies on the search for potential dopant candidates.<\/span><br>\nProf. Yasuteru Shigeta, University of Tsukuba\n<div class=\"chairs\">Session Chair: Tsuyoshi Moriya, Tokyo Electron<\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">10:15<\/td>\n<td class=\"tbl_cell_room1\">Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">10:20<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">Tutorial Speech-3<br>The History and Future of Semiconductor Lithography: New Prospects Beyond the Limits of Pattern Shrinking<\/span><br>\nDr. Tatsuhiko Higashiki, Kioxia\n<div class=\"chairs\">Session Chair: Ayako Shimazaki, Toshiba Nanoanalysis<\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">10:50<\/td>\n<td class=\"tbl_cell_room1\">Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">11:00<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">Keynote Speech-1<br>Semiconductor Ecosystem : India-Japan Strategic Partnership<\/span><br>\nH.E. Mr. Sibi George, Ambassador of India to Japan\n<div class=\"chairs\">Session Chair: Shozo Saito, Nippon Electronic Device Industry Association(NEDIA)<\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">11:15<\/td>\n<td class=\"tbl_cell_room1\">Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">11:30<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">Keynote Speech-2<br>Japan\u2019s semiconductor strategy<\/span><br>\nHidemichi Shimizu, Ministry of Economy, Trade and Industry\n<div class=\"chairs\">Session Chair: Hiroshi Akahori, Rapidus<\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">12:10<\/td>\n<td class=\"tbl_cell_room1\">Sponsor Exhibition (on-site) &#038; Lunch Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">13:20<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">Keynote Speech-3<br>AI and Semiconductor Manufacturing \u2013 opportunities and challenges<\/span><br>\nDr. Daisuke Okanohara, Preferred Networks, Inc.\n<div class=\"chairs\">Session Chair: Tsuyoshi Moriya, Tokyo Electron<\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">14:00<\/td>\n<td class=\"tbl_cell_room1\">Break<\/td>\n<\/tr>\n<\/table>\n<hr class=\"wp-block-separator has-alpha-channel-opacity is-style-wide\"\/>\n<h3 class=\"room1\">Room A : KFC Hall<\/h3>\n<h4 class=\"bottom_narrow\">Session A-1 : Manufacturing Control and Execution (MC)<\/h4>\n<p class=\"bottom_narrow\">Session Co-chairs: Hiroyuki Inoue, Texas Instruments Japan \/ Minoru Inomoto, KIOXIA<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_room1\">14:10<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">MC-044 : Deep Reinforcement Learning-based Effective Training Design for Dynamic Machine Allocation with Case Study of a Semiconductor Tool Group<\/span><br>\nHsin-Tzu Hsu, National Taiwan University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">14:30<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">MC-028 : Multi-factory scheduling considering the trade-offs  between production efficiency and risks<\/span><br>\nYurika Suzuki, University of Tsukuba<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">14:50<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">MC-026 : AI and Digital Twin Integration in Autonomous Robot Orchestration Solution (AROS)<\/span><br>\nYoung Jae JANG, KAIST<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">15:10<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\"><span class=\"red\">&lt;Withdraw&gt;<\/span><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">15:30<\/td>\n<td class=\"tbl_cell_room1\">Author&#8217;s Interview &#038; Exhibition (On-Site ONLY)&#038; Break<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow\">Session A-2: EDTM&#038;Process Monitoring and Control Method (PC)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Shin-ichi Imai, Hitachi High-Tech \/ Satoko Nakagawa, GlobalWafers Japan<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_room1\">15:50<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span>&nbsp;&lt;INVITED&gt;EDTM-215 : Reduction of contact resistance to PVD-MoS2 film using aluminum\u2013scandium alloy (AlSc) edge contact<\/span><br>\nProf. Hitoshi Wakabayashi,  Institute of Science Tokyo<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">16:10<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">&lt;INVITED&gt;PC-042 : Understanding Surface Reaction in PECVD Process by Combining In-situ Monitoring and Machine Learning<\/span><br>\nMakoto Sekine, Takayoshi Tsutsumi, Nagoya University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">16:30<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">PC-039 : Novel Optical Gas Analyzers based on Self-Plasma Optical Emission Spectroscopy and their applications in Semiconductor Manufacturing<\/span><br>\nKazuki Yanagita, Huidong Zang, INFICON<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">16:50<\/td>\n<td class=\"tbl_cell_room1\">Author&#8217;s Interview  (On-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow\">Session A-3: Process Monitoring and Control Method (PC)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Masami Aoki, KLA-Tencor Japan \/ Takayuki Matsumoto, United Semiconductor Japan<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_room1\">17:10<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">PC-034 : Proactive Control Setting of Real Time Equipment Monitoring for Raising End-of-Line Process Performance<\/span><br>\nKuan-Chun Lin, National Taiwan University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">17:30<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">PC-010 : Classification of Multivariate Time Series Signals Using Self-Supervised Representation Learning for Condition Monitoring<\/span><br>\nKoichi Sumiya, University of Tsukuba<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">17:50<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">PC-017 : AI\/ML Deployment at the Edge for Run-by-Run and Real-Time Analysis<\/span><br>\nAnthony Vasquez, INFICON<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">18:10<\/td>\n<td class=\"tbl_cell_room1\">Author&#8217;s Interview (On-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">18:30<br>&#8211;<br>20:00<\/td>\n<td class=\"tbl_cell_room1\">Reception<\/td>\n<\/tr>\n<\/table>\n<hr class=\"wp-block-separator has-alpha-channel-opacity is-style-wide\"\/>\n<h3 class=\"room2\">Room B: KFC Hall Annex<\/h3>\n<h4 class=\"bottom_narrow room2\">Session B-1 : Process\/Material Optimization (PO)<\/h4>\n<p class=\"bottom_narrow\">Session Co-chairs: Isamu Namose, OMRON \/ Toshio Konishi, Tekscend Photomask <\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_room2\">14:10<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">PO-014 : Optimal Design of Wet Etching Bath for 3D Flash Memories Using Multi-Objective Bayesian Optimization<\/span><br>\nMiyuki Kouda, Kioxia<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">14:30<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">PO-023 : Space-filling experimental design for efficient Bayesian optimization<\/span><br>\nShigeru Kinoshita, Kioxia<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">14:50<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">PO-007 : Vacancy-type defects in thin HfO2 layers probed by monoenergetic positron beams<\/span><br>\nAkira Uedono, University of Tsukuba<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">15:10<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">PO-021 : Characterization of Hydrogen Desorption and Charge Traps in Silicon Nitride Films<\/span><br>\nKiyoteru Kobayashi, ESCO, Ltd.<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">15:30<\/td>\n<td class=\"tbl_cell_room2\">Author&#8217;s Interview &#038; Exhibition (On-Site ONLY)&#038; Break<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow room2\">Session B-2: EDTM&#038; Process\/Material Optimization (PO)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Shinsuke Mizuno, Applied Materials Japan \/ Ayako Shimazaki, Toshiba Nanoanalysis<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_room2\">15:50<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">&lt;INVITED&gt;EDTM-496 : SiC Materials and Devices for Future Green Society<\/span><br>\nProf. Shin-ichi Nishizawa, Kyushu University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">16:10<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">PO-032 : Improvement of P-base contact resistance in power MOSFETs and its impact on avalanche capability<\/span><br>\nKeisuke Miyamoto, TOSHIBA ELECTRONIC DEVICES &#038; STORAGE<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">16:30<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">PO-019 : Avalanche Capability Improvement by Ion Implantation-induced Defects Control for Trench Power MOSFET<\/span><br>\nKatsumi Rikimaru, TOSHIBA ELECTRONIC DEVICES &#038; STORAGE<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">16:50<\/td>\n<td class=\"tbl_cell_room2\">Author&#8217;s Interview  (On-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow room2\">Session B-3: Process\/Material Optimization (PO)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Shun-ichiro Ohmi, Institute of Science Tokyo \/ Yuki Yamada, JX Advanced Metals<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_room2\">17:10<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">PO-046 : Ar\/N2 gas flow rate dependence on the ferroelectric HfN1.15 thin film formation  by ECR-plasma sputtering<\/span><br>\nKANGBAI LI,  Institute of Science Tokyo<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">17:30<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">PO-024 : Investigation on the Relationship Etching Rate and Photoresist Surface Temperature  during Reactive Atmospheric-pressure Thermal Plasma Jet Irradiation<\/span><br>\nKyohei Matsumoto, Hiroshima University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">17:50<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">PO-029 : First-Principles Analysis for Estimating the Gettering Effects of Vacancy\u2013Oxygen Complexes (VOx) in Rapid Thermal Processing Wafers<\/span><br>\nHiroya Iwashiro, GlobalWafers Japan<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">18:10<\/td>\n<td class=\"tbl_cell_room2\">Author&#8217;s Interview (On-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">18:30<br>&#8211;<br>20:00<\/td>\n<td class=\"tbl_cell_room2\">Reception<\/td>\n<\/tr>\n<\/table>\n<\/div>\n<div class=\"su-tabs-pane su-u-clearfix su-u-trim\" data-title=\"Day 2\">\n<h2>DAY2 &#8211; December 10 <\/h2>\n<h3 class=\"room1\">Room A : KFC Hall<\/h3>\n<h4>Plenary Session<\/h4>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_room1\">8:30<\/td>\n<td class=\"tbl_cell_room1\">Registration<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">9:00<\/td>\n<td class=\"tbl_cell_room1\">Program Outline by ISSM program Committee Chair<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">9:10<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">Keynote Speech-4<br>2nm Node Interconnect Technology and R&#038;D toward 1.4nm Node and Beyond<\/span><br>\nDr. Takeshi Nogami, IBM Research\n<div class=\"chairs\">Session Chair: Katsutoshi Ozawa, OMRON <\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">9:50<\/td>\n<td class=\"tbl_cell_room1\">Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">10:00<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">Keynote Speech-5<br>Research and development in NTT Basic Research Laboratories towards IOWN and beyond<\/span><br>\nDr. Katsuya Oguri, NTT\n<div class=\"chairs\">Session Chair: Shun-ichiro Ohmi, Institute of Science Tokyo<\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">10:40<\/td>\n<td class=\"tbl_cell_room1\">Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">10:50<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">Keynote Speech-6<br>Highly Accurate Via Formation Technologies for Advanced Packaging Process Using Plasma Dry Etching<\/span><br>\nDr. Yasuhiro Morikawa, ULVAC\n<div class=\"chairs\">Session Chair: Kenji Miyake, Office Miyake<\/div><\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">11:30<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">3mins Flash Presentation by Poster Speakers<\/span>\n<ul style=\"list-style:none;\">\n<li><span class=\"title_strong\">PO-008 : Optimization of post-deposition annealing conditions for p-type SnO fabrication by low-concentration hydrogen sputtering using SnO2 sputtering target<\/span><br>\nTsubasa Kobayashi, Kogakuin University<\/li>\n<li><span class=\"title_strong\">PO-011 : Enhancing Process Engineering Decision-Making with Model Visualization Techniques<\/span><br>\nHironori Chatani, ULVAC<\/li>\n<li><span class=\"title_strong\">ES-012 : A New Operational Method for Green Transformation in Semiconductor Manufacturing<\/span><br>\nToshiya Soyama, ULVAC<\/li>\n<li><span class=\"title_strong\">PO-031 : Fabrication of SnSO4 transparent thin-films using simultaneous oxidation and sulfurization annealing<\/span><br>\nKento Moriya, Kogakuin University<\/li>\n<li><span class=\"title_strong\">PO-038 : UV exposure in an oxygen atmosphere at room temperature as a new method for  improvement of amorphous oxide TFT characteristics<\/span><br>\nShinri Yamadera, Kogakuin University<\/li>\n<li><span class=\"title_strong\">PO-040 : Strong amorphization in In2O3-based flexible transparent conductive films by hydrogen incorporation and higher sputtering pressure<\/span><br>\nKanta Kibishi, Kogakuin University<\/li><\/ul>\n<div class=\"chairs\">Session Co-chairs: Minoru Inomoto, KIOXIA \/ Toshio Konishi, Tekscend Photomask<\/div>\n<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">12:00<\/td>\n<td class=\"tbl_cell_room1\">Poster Session, Sponsor Exhibition &#038; Lunch Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">13:00<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">Special Session<br>Improving energy efficiency and development efficiency<\/span><br>\nProf. Tadahiro Kuroda, The University of Tokyo\n<div class=\"chairs\">Session chair: Shuichi Inoue, ATONARP<\/div>\n<span class=\"title_strong\">Human resources to vitalize Japan&#8217;s semiconductor industry<\/span><br>\nThe short panel discussion following by the special talk by Prof. Kuroda will discuss about the critical challenges facing by the semiconductor industry.\nThe topics may include:\n<ul style=\"list-style:none;\">\n<li>&#8211; What kind of skills do engineers need for an advanced semiconductor plant, and how can they be trained?<\/li>\n<li>&#8211; What human resources are needed to weave the missing pieces for Japan&#8217;s semiconductor industry?<\/li>\n<li>&#8211; How do we solve the issues?<\/li>\n<\/ul>\n<ul style=\"list-style:none;\">\n<li>Moderator:<br>Shuichi Inoue, ATONARP INC.<\/li>\n<li>Panelists:<br>\nTadahiro Kuroda, The University of Tokyo\/Prefectural University of Kumamoto<br>\nKazunori Kato, Advanced Interface Technology Corporation<br>\nKenji Miyake, Office Miyake<br>\nShin-ichi Imai, Hitachi High-Tech<\/li>\n<\/ul>\n<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">13:50<\/td>\n<td class=\"tbl_cell_room1\">Break<\/td>\n<\/tr>\n<\/table>\n<hr class=\"wp-block-separator has-alpha-channel-opacity is-style-wide\"\/>\n<h3 class=\"room1\">Room A : KFC Hall<\/h3>\n<h4 class=\"bottom_narrow\">Session A-4 : IITC &#038; Yield Enhancement and Methodology (YE)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs:Kazunori Kato, Advanced Interface Technology \/  Shun-ichiro Ohmi, Institute of Science Tokyo<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_room1\">14:00<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span>&nbsp;&lt;INVITED&gt;IITC-11.5 : Bonding induced distortion in wafer-to-wafer bonding applications: how the scanner and Yieldstar can enable 3D integration<\/span><br>\nV.M. Blanco Carballo, IMEC<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">14:20<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">YE-013 : Accuracy Improvement of Chip-on-Wafer Surface Defect Inspection by Deep Learning<\/span><br>\nKazuto Kawakatsu, Sony Semiconductor Solutions<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">14:40<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span>&nbsp;&lt;INVITED&gt;IITC-11.4 : Study and Control of the Distortion Induced by the Bonding Process for BSPDN Approaches<\/span><br>\nKarine Abadie, CEA-Leti<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">15:00<\/td>\n<td class=\"tbl_cell_room1\">Author&#8217;s Interview (ON-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow\">Session A-5: Yield Enhancement and Methodology (YE)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs:Takatoshi Yasui, Tower Partners Semiconductor \/ Takayuki Matsumoto, United Semiconductor Japan<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_room1\">15:20<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">YE-018 : Evaluation of Metal Contamination Behavior on Silicon Dioxide Surface Rinsed with Deionized Water Containing Ultra-trace Metal in Single-wafer Cleaning Process<\/span><br>\nKyohei Tsutano, ORGANO<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">15:40<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">YE-033 : Rapid and Flexible Yield Analysis Powered by Large Language Model<\/span><br>\nYutaka Sawai, Rohm<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">16:00<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">YE-022 : Annotation Effort Reduction for Introducing AI into Optical Inspection Systems<\/span><br>\nKenta Horide, SCREEN Advanced System Solutions<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">16:20<\/td>\n<td class=\"tbl_cell_room1\">Author&#8217;s Interview (ON-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow\">Session A-6: Manufacturing Control and Execution (MC) &#038; Design for Manufacturing (DM) &#038; IITC<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs:Takayuki Hisamatsu, Sony Semiconductor Manufacturing \/ Shinsuke Mizuno, Applied Materials Japan<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_room1\">16:40<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">MC-045 : Predictive Equipment State Based on Hidden Markov Model and Production Plan<\/span><br>\nJakey Blue, National Taiwan University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">17:00<\/td>\n<td class=\"tbl_cell_room1\">\n<span class=\"title_strong\">DM-020 : Automatic Disassembly Standard Time Estimate System For improving Etch System Maintenance<\/span><br>\nAtsuko Enomoto, Hitachi<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">17:20<\/td>\n<td class=\"tbl_cell_room1\">Author&#8217;s Interview (ON-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">17:40<\/td>\n<td class=\"tbl_cell_room1\">Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room1\">18:00<br>&#8211;<br>18:30<\/td>\n<td class=\"tbl_cell_room1\">Best Paper&#038;Student Awards, Farewell Party<\/td>\n<\/tr>\n<\/table>\n<hr class=\"wp-block-separator has-alpha-channel-opacity is-style-wide\"\/>\n<h3 class=\"room2\">Room B: KFC Hall Annex<\/h3>\n<h4 class=\"bottom_narrow room2\">Session B-4: EDTM &#038; Process Monitoring and Control Method (PC)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs: Masami Aoki, KLA-Tencor Japan \/ Satoko Nakagawa, GlobalWafers Japan<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_room2\">14:00<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\"><span class=\"orange\">ONLINE<\/span>&nbsp;&lt;INVITED&gt;EDTM-470 : Intermetallic compounds for future ULSI metallization<\/span><br>\nProf. Junichi Koike, Tohoku University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">14:20<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">PC-015 : Virtual Metrology using Transfer Learning with Domain Knowledge<\/span><br>\nMasaaki Takada, Toshiba<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">14:40<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">PC-009 : Quick update of Virtual Metrology using Weighted Transfer Lasso<\/span><br>\nKazuya Kikuchi, TOSHIBA ELECTRONIC DEVICES &#038; STORAGE<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">15:00<\/td>\n<td class=\"tbl_cell_room2\">Author&#8217;s Interview (ON-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow room2\">Session B-5 : Process Monitoring and Control Method (PC)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs:Tsuyoshi Moriya, TEL \/ Yuki Yamada, JX Advanced Metals<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_room2\">15:20<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">PC-043 : Fast Temperature Control in Semiconductor Vertical Furnace with Time-Optimal Control and Iterative Experiments<\/span><br>\nChristian Milleneuve Budiono, The University of Tokyo<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">15:40<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">PC-030 : Case Study on Modeling of Multiple Process Using Intermediate Variables for Digital Twin Modeling of a Semiconductor Manufacturing<\/span><br>\nRyosuke Okachi, Toyota Central R&#038;D Labs., Inc.<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">16:00<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">PC-037 : Improvement of Process Conditions using Hierarchical Optimization<\/span><br>\nTatsuya Watanabe, Sony Semiconductor Manufacturing<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">16:20<\/td>\n<td class=\"tbl_cell_room2\">Author&#8217;s Interview (ON-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<\/table>\n<h4 class=\"bottom_narrow room2\">Session B-6 : Intelligent Data Management (ID)<\/h4>\n<p class=\"bottom_narrow\">Session Co-Chairs:Kazuhito Matsukawa, SUMCO \/ Hiroyuki Inoue, Texas Instruments Japan<\/p>\n<table width=\"100%\">\n<tr>\n<td class=\"tbl_time_room2\">16:40<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">ID-035 : Classifiers and Clustering Based Approach for Imbalanced Wafer Map Data<\/span><br>\nKenji Kanda, Mie University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">17:00<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">ID-036 : Unsupervised and Spectral Feature-based Sensor Relation Identification for Advanced Equipment Anomaly Detection<\/span><br>\nChieh-Yu Chen, National Taiwan University<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">17:20<\/td>\n<td class=\"tbl_cell_room2\">\n<span class=\"title_strong\">ID-025 : Generalized vs. Individualized Kaplan-Meier Time-to-Failure Predictive Models for Preventative Maintenance in Semiconductor Manufacturing<\/span><br>\nTori Wright, University of Central Florida<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">17:40<\/td>\n<td class=\"tbl_cell_room2\">Author&#8217;s Interview (ON-Site ONLY) &#038; Break<\/td>\n<\/tr>\n<tr>\n<td class=\"tbl_time_room2\">18:00<br>&#8211;<br>18:30<\/td>\n<td class=\"tbl_cell_room2\">Best Paper&#038;Student Awards, Farewell Party<\/td>\n<\/tr>\n<\/table>\n<\/div><\/div><\/div>\n\n\n\n<p class=\"wp-block-paragraph\"><\/p>\n","protected":false},"excerpt":{"rendered":"","protected":false},"author":2,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-2818","page","type-page","status-publish","hentry"],"aioseo_notices":[],"aioseo_head":"\n\t\t<!-- All in One SEO 4.9.10 - aioseo.com -->\n\t<meta name=\"description\" content=\"Program Schedule is in JST(UTC+9) Program Schedule is s\" \/>\n\t<meta name=\"robots\" content=\"max-image-preview:large\" \/>\n\t<link rel=\"canonical\" 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