Program - ISSM 2024

Program Schedule is in JST(UTC+9)
Program Schedule is subject to change

Day 1Day 2

DAY1 – December 9

Room A : KFC Hall

Plenary Session

8:15	Registration
9:00	Opening Opening Remarks Conference OutlineProgram Schedule Shozo Saito, ISSM Organizing Committee Chair Ayako Shimazaki, ISSM Executive Committee Chair Shin-ichi Imai, ISSM Program Committee Chair MC: Shuichi Inoue, ATONARP Inc.
9:10	Tutorial Speech-1 50 years of thin film processing innovation in SC industry Prof. Christophe Vallée, University at Albany, CNSE Session Chair: Tsuyoshi Moriya, Tokyo Electron
9:40	Break
9:45	Tutorial Speech-2 Computational materials science studies on the search for potential dopant candidates. Prof. Yasuteru Shigeta, University of Tsukuba Session Chair: Tsuyoshi Moriya, Tokyo Electron
10:15	Break
10:20	Tutorial Speech-3 The History and Future of Semiconductor Lithography: New Prospects Beyond the Limits of Pattern Shrinking Dr. Tatsuhiko Higashiki, Kioxia Session Chair: Ayako Shimazaki, Toshiba Nanoanalysis
10:50	Break
11:00	Keynote Speech-1 Semiconductor Ecosystem : India-Japan Strategic Partnership H.E. Mr. Sibi George, Ambassador of India to Japan Session Chair: Shozo Saito, Nippon Electronic Device Industry Association(NEDIA)
11:15	Break
11:30	Keynote Speech-2 Japan’s semiconductor strategy Hidemichi Shimizu, Ministry of Economy, Trade and Industry Session Chair: Hiroshi Akahori, Rapidus
12:10	Sponsor Exhibition (on-site) & Lunch Break
13:20	Keynote Speech-3 AI and Semiconductor Manufacturing – opportunities and challenges Dr. Daisuke Okanohara, Preferred Networks, Inc. Session Chair: Tsuyoshi Moriya, Tokyo Electron
14:00	Break

Room A : KFC Hall

Session A-1 : Manufacturing Control and Execution (MC)

Session Co-chairs: Hiroyuki Inoue, Texas Instruments Japan / Minoru Inomoto, KIOXIA

14:10	MC-044 : Deep Reinforcement Learning-based Effective Training Design for Dynamic Machine Allocation with Case Study of a Semiconductor Tool Group Hsin-Tzu Hsu, National Taiwan University
14:30	MC-028 : Multi-factory scheduling considering the trade-offs between production efficiency and risks Yurika Suzuki, University of Tsukuba
14:50	MC-026 : AI and Digital Twin Integration in Autonomous Robot Orchestration Solution (AROS) Young Jae JANG, KAIST
15:10	<Withdraw>
15:30	Author’s Interview & Exhibition (On-Site ONLY)& Break

Session A-2: EDTM&Process Monitoring and Control Method (PC)

Session Co-Chairs: Shin-ichi Imai, Hitachi High-Tech / Satoko Nakagawa, GlobalWafers Japan

15:50	ONLINE <INVITED>EDTM-215 : Reduction of contact resistance to PVD-MoS2 film using aluminum–scandium alloy (AlSc) edge contact Prof. Hitoshi Wakabayashi, Institute of Science Tokyo
16:10	<INVITED>PC-042 : Understanding Surface Reaction in PECVD Process by Combining In-situ Monitoring and Machine Learning Makoto Sekine, Takayoshi Tsutsumi, Nagoya University
16:30	PC-039 : Novel Optical Gas Analyzers based on Self-Plasma Optical Emission Spectroscopy and their applications in Semiconductor Manufacturing Kazuki Yanagita, Huidong Zang, INFICON
16:50	Author’s Interview (On-Site ONLY) & Break

Session A-3: Process Monitoring and Control Method (PC)

Session Co-Chairs: Masami Aoki, KLA-Tencor Japan / Takayuki Matsumoto, United Semiconductor Japan

17:10	PC-034 : Proactive Control Setting of Real Time Equipment Monitoring for Raising End-of-Line Process Performance Kuan-Chun Lin, National Taiwan University
17:30	PC-010 : Classification of Multivariate Time Series Signals Using Self-Supervised Representation Learning for Condition Monitoring Koichi Sumiya, University of Tsukuba
17:50	PC-017 : AI/ML Deployment at the Edge for Run-by-Run and Real-Time Analysis Anthony Vasquez, INFICON
18:10	Author’s Interview (On-Site ONLY) & Break
18:30 – 20:00	Reception

Room B: KFC Hall Annex

Session B-1 : Process/Material Optimization (PO)

Session Co-chairs: Isamu Namose, OMRON / Toshio Konishi, Tekscend Photomask

14:10	PO-014 : Optimal Design of Wet Etching Bath for 3D Flash Memories Using Multi-Objective Bayesian Optimization Miyuki Kouda, Kioxia
14:30	PO-023 : Space-filling experimental design for efficient Bayesian optimization Shigeru Kinoshita, Kioxia
14:50	PO-007 : Vacancy-type defects in thin HfO2 layers probed by monoenergetic positron beams Akira Uedono, University of Tsukuba
15:10	PO-021 : Characterization of Hydrogen Desorption and Charge Traps in Silicon Nitride Films Kiyoteru Kobayashi, ESCO, Ltd.
15:30	Author’s Interview & Exhibition (On-Site ONLY)& Break

Session B-2: EDTM& Process/Material Optimization (PO)

Session Co-Chairs: Shinsuke Mizuno, Applied Materials Japan / Ayako Shimazaki, Toshiba Nanoanalysis

15:50	<INVITED>EDTM-496 : SiC Materials and Devices for Future Green Society Prof. Shin-ichi Nishizawa, Kyushu University
16:10	PO-032 : Improvement of P-base contact resistance in power MOSFETs and its impact on avalanche capability Keisuke Miyamoto, TOSHIBA ELECTRONIC DEVICES & STORAGE
16:30	PO-019 : Avalanche Capability Improvement by Ion Implantation-induced Defects Control for Trench Power MOSFET Katsumi Rikimaru, TOSHIBA ELECTRONIC DEVICES & STORAGE
16:50	Author’s Interview (On-Site ONLY) & Break

Session B-3: Process/Material Optimization (PO)

Session Co-Chairs: Shun-ichiro Ohmi, Institute of Science Tokyo / Yuki Yamada, JX Advanced Metals

17:10	PO-046 : Ar/N2 gas flow rate dependence on the ferroelectric HfN1.15 thin film formation by ECR-plasma sputtering KANGBAI LI, Institute of Science Tokyo
17:30	PO-024 : Investigation on the Relationship Etching Rate and Photoresist Surface Temperature during Reactive Atmospheric-pressure Thermal Plasma Jet Irradiation Kyohei Matsumoto, Hiroshima University
17:50	PO-029 : First-Principles Analysis for Estimating the Gettering Effects of Vacancy–Oxygen Complexes (VOx) in Rapid Thermal Processing Wafers Hiroya Iwashiro, GlobalWafers Japan
18:10	Author’s Interview (On-Site ONLY) & Break
18:30 – 20:00	Reception

DAY2 – December 10

Room A : KFC Hall

Plenary Session

8:30	Registration
9:00	Program Outline by ISSM program Committee Chair
9:10	Keynote Speech-4 2nm Node Interconnect Technology and R&D toward 1.4nm Node and Beyond Dr. Takeshi Nogami, IBM Research Session Chair: Katsutoshi Ozawa, OMRON
9:50	Break
10:00	Keynote Speech-5 Research and development in NTT Basic Research Laboratories towards IOWN and beyond Dr. Katsuya Oguri, NTT Session Chair: Shun-ichiro Ohmi, Institute of Science Tokyo
10:40	Break
10:50	Keynote Speech-6 Highly Accurate Via Formation Technologies for Advanced Packaging Process Using Plasma Dry Etching Dr. Yasuhiro Morikawa, ULVAC Session Chair: Kenji Miyake, Office Miyake
11:30	3mins Flash Presentation by Poster Speakers PO-008 : Optimization of post-deposition annealing conditions for p-type SnO fabrication by low-concentration hydrogen sputtering using SnO2 sputtering target Tsubasa Kobayashi, Kogakuin University PO-011 : Enhancing Process Engineering Decision-Making with Model Visualization Techniques Hironori Chatani, ULVAC ES-012 : A New Operational Method for Green Transformation in Semiconductor Manufacturing Toshiya Soyama, ULVAC PO-031 : Fabrication of SnSO4 transparent thin-films using simultaneous oxidation and sulfurization annealing Kento Moriya, Kogakuin University PO-038 : UV exposure in an oxygen atmosphere at room temperature as a new method for improvement of amorphous oxide TFT characteristics Shinri Yamadera, Kogakuin University PO-040 : Strong amorphization in In2O3-based flexible transparent conductive films by hydrogen incorporation and higher sputtering pressure Kanta Kibishi, Kogakuin University Session Co-chairs: Minoru Inomoto, KIOXIA / Toshio Konishi, Tekscend Photomask
12:00	Poster Session, Sponsor Exhibition & Lunch Break
13:00	Special Session Improving energy efficiency and development efficiency Prof. Tadahiro Kuroda, The University of Tokyo Session chair: Shuichi Inoue, ATONARP Human resources to vitalize Japan’s semiconductor industry The short panel discussion following by the special talk by Prof. Kuroda will discuss about the critical challenges facing by the semiconductor industry. The topics may include: – What kind of skills do engineers need for an advanced semiconductor plant, and how can they be trained? – What human resources are needed to weave the missing pieces for Japan’s semiconductor industry? – How do we solve the issues? Moderator: Shuichi Inoue, ATONARP INC. Panelists: Tadahiro Kuroda, The University of Tokyo/Prefectural University of Kumamoto Kazunori Kato, Advanced Interface Technology Corporation Kenji Miyake, Office Miyake Shin-ichi Imai, Hitachi High-Tech
13:50	Break

Room A : KFC Hall

Session A-4 : IITC & Yield Enhancement and Methodology (YE)

Session Co-Chairs:Kazunori Kato, Advanced Interface Technology / Shun-ichiro Ohmi, Institute of Science Tokyo

14:00	ONLINE <INVITED>IITC-11.5 : Bonding induced distortion in wafer-to-wafer bonding applications: how the scanner and Yieldstar can enable 3D integration V.M. Blanco Carballo, IMEC
14:20	YE-013 : Accuracy Improvement of Chip-on-Wafer Surface Defect Inspection by Deep Learning Kazuto Kawakatsu, Sony Semiconductor Solutions
14:40	ONLINE <INVITED>IITC-11.4 : Study and Control of the Distortion Induced by the Bonding Process for BSPDN Approaches Karine Abadie, CEA-Leti
15:00	Author’s Interview (ON-Site ONLY) & Break

Session A-5: Yield Enhancement and Methodology (YE)

Session Co-Chairs:Takatoshi Yasui, Tower Partners Semiconductor / Takayuki Matsumoto, United Semiconductor Japan

15:20	YE-018 : Evaluation of Metal Contamination Behavior on Silicon Dioxide Surface Rinsed with Deionized Water Containing Ultra-trace Metal in Single-wafer Cleaning Process Kyohei Tsutano, ORGANO
15:40	YE-033 : Rapid and Flexible Yield Analysis Powered by Large Language Model Yutaka Sawai, Rohm
16:00	YE-022 : Annotation Effort Reduction for Introducing AI into Optical Inspection Systems Kenta Horide, SCREEN Advanced System Solutions
16:20	Author’s Interview (ON-Site ONLY) & Break

Session A-6: Manufacturing Control and Execution (MC) & Design for Manufacturing (DM) & IITC

Session Co-Chairs:Takayuki Hisamatsu, Sony Semiconductor Manufacturing / Shinsuke Mizuno, Applied Materials Japan

16:40	MC-045 : Predictive Equipment State Based on Hidden Markov Model and Production Plan Jakey Blue, National Taiwan University
17:00	DM-020 : Automatic Disassembly Standard Time Estimate System For improving Etch System Maintenance Atsuko Enomoto, Hitachi
17:20	Author’s Interview (ON-Site ONLY) & Break
17:40	Break
18:00 – 18:30	Best Paper&Student Awards, Farewell Party

Room B: KFC Hall Annex

Session B-4: EDTM & Process Monitoring and Control Method (PC)

Session Co-Chairs: Masami Aoki, KLA-Tencor Japan / Satoko Nakagawa, GlobalWafers Japan

14:00	ONLINE <INVITED>EDTM-470 : Intermetallic compounds for future ULSI metallization Prof. Junichi Koike, Tohoku University
14:20	PC-015 : Virtual Metrology using Transfer Learning with Domain Knowledge Masaaki Takada, Toshiba
14:40	PC-009 : Quick update of Virtual Metrology using Weighted Transfer Lasso Kazuya Kikuchi, TOSHIBA ELECTRONIC DEVICES & STORAGE
15:00	Author’s Interview (ON-Site ONLY) & Break

Session B-5 : Process Monitoring and Control Method (PC)

Session Co-Chairs:Tsuyoshi Moriya, TEL / Yuki Yamada, JX Advanced Metals

15:20	PC-043 : Fast Temperature Control in Semiconductor Vertical Furnace with Time-Optimal Control and Iterative Experiments Christian Milleneuve Budiono, The University of Tokyo
15:40	PC-030 : Case Study on Modeling of Multiple Process Using Intermediate Variables for Digital Twin Modeling of a Semiconductor Manufacturing Ryosuke Okachi, Toyota Central R&D Labs., Inc.
16:00	PC-037 : Improvement of Process Conditions using Hierarchical Optimization Tatsuya Watanabe, Sony Semiconductor Manufacturing
16:20	Author’s Interview (ON-Site ONLY) & Break

Session B-6 : Intelligent Data Management (ID)

Session Co-Chairs:Kazuhito Matsukawa, SUMCO / Hiroyuki Inoue, Texas Instruments Japan

16:40	ID-035 : Classifiers and Clustering Based Approach for Imbalanced Wafer Map Data Kenji Kanda, Mie University
17:00	ID-036 : Unsupervised and Spectral Feature-based Sensor Relation Identification for Advanced Equipment Anomaly Detection Chieh-Yu Chen, National Taiwan University
17:20	ID-025 : Generalized vs. Individualized Kaplan-Meier Time-to-Failure Predictive Models for Preventative Maintenance in Semiconductor Manufacturing Tori Wright, University of Central Florida
17:40	Author’s Interview (ON-Site ONLY) & Break
18:00 – 18:30	Best Paper&Student Awards, Farewell Party