- Program Schedule is in JST(UTC+9)
- Program Schedule is subject to change
Day 1Day 2
DAY1 – December 12th
Room : KFC Hall
Plenary Session
| 8:15 | Registration |
| 8:45 |
Opening MC: Shuichi Inoue, ISSM Organizing Committee Vice Chair Opening Remarks by Shozo Saito, ISSM Organizing Committee Chair Conference Outline by Ayako Shimazaki, ISSM Executive Committee Chair Program Schedule by Shin-ichi Imai, ISSM Program Committee Chair |
| 9:00 |
Tutorial Speech-1 Challenges of Plasma Science and Technology for Green Semiconductor Manufacturing Dr.Masaru Hori, Nagoya University Session Co-Chairs: Ayako Shimazaki, Toshiba Nanoanalysis / Tsuyoshi Moriya, Tokyo Electron
Presentation will be in Japanese. Interpretation into English will be provided. |
| 9:40 | Break |
| 9:50 |
Tutorial Speech-2 Atomic-level control of plasma processing toward sub-nm node technologies Dr. Satoshi Hamaguchi, Osaka University Session Co-Chairs: Ayako Shimazaki, Toshiba Nanoanalysis / Tsuyoshi Moriya, Tokyo Electron
Presentation will be in Japanese. Interpretation into English will be provided. |
| 10:30 | Break |
| 10:40 | Technical Session A-1 & B-1 |
| 12:00 | Sponsor Exhibition (on-site) & Video (Sponosr: Silver-Platinum) / Lunch Break |
| 12:50 |
Keynote Speech-1 Cutting Edge Technologies of Power Semiconductor Device Applications for Electric Vehicle’s Power Electronics Systems in Japan, US, Europe and China Case Dr. Masayoshi Yamamoto, Nagoya University Session Chair: Kazunori Kato, Advanced Interface Technology |
| 13:30 | Break |
| 13:40 |
LIVE ONLY NO Q&A / NO ON-Demand Keynote Speech-2 The Contribution and Expectation of TSMC Japan 3DIC R&D Center to Japan Industry Mr. Yutaka Emoto, TSMC Japan 3DIC R&D Center, Inc. Session Chair: Kazuhito Matsukawa, SUMCO |
| 14:20 | Break |
Room 1 : KFC Hall
Session A-1 : Manufacturing Strategy (MS) & Environment, Safety and Health, Carbon Neutral (ES) & Fab Operation Method (FO)
Session Co-Chairs: Katsutoshi Ozawa, OMRON / Takahiro Tsuchiya, United Semiconductor Japan
| 10:40 |
MS-44 : A Novel Approach to Dynamic Line Balance Control and Scheduling with a Digital Twin Production System Hirofumi Tsuchiyama, INFICON |
| 11:00 |
ES-62 : Self-tuning optimization to compatible the delivery and low energy consumption Chending MAO, University of Tsukuba |
| 11:20 |
ONLINE FO-43 : Maintenance Content Reduction and Digitalization for Performance Optimization Christopher Bode, INFICON |
| 11:40 | Author’s Interview (On-Site ONLY) & Break |
| 12:00 | Sponsor Exhibition (on-site) & Video (Sponosr: Silver-Platinum) / Lunch Break |
| 12:50 – 14:30 | Plenary Session |
Session A-2: Invited & Highlight AI
Session Co-Chairs: Isamu Namose, OMRON / Takatoshi Yasui, Tower Partners Semiconductor
| 14:30 |
Invited EDTM-01 : Inter Spike Interval and Stochasticity Engineering of Floating Gate Technology-based Neurons for Spiking Neural Network Hardware Akira Goda, University of Tokyo |
| 14:50 |
YD-21 : Noise Reduction in SEM Images using Deep Learning Yuki Sato, Tokyo Electron |
| 15:10 |
ID-6 : Application of Natural Language Processing in Semiconductor Manufacturing Daisuke Kobayashi, Sony Semiconductor Manufacturing Corporation |
| 15:30 | Author’s Interview & Exhibition (On-Site ONLY)& Break |
Session A-3: Highlight AI
Session Co-Chairs: Takatoshi Yasui, Tower Partners Semiconductor / Masami Aoki, KLA-Tencor Japan
| 16:00 |
YD-10 : Positive/Negative Decision via Outlier Detection Towards Automatic Performance Evaluation for Defect Detector Toshinori Yamauchi, Hitachi High-Tech |
| 16:20 |
YD-15 : A Study on Detection Method Using 2-Class Classifiers for Defective Wafer Maps Seima Sakaguchi, Mie University |
| 16:40 |
ONLINE YD-5 : Yield prediction with Machine Learning and parameter limits in semiconductor production Rebecca Busch, University of Siegen |
| 17:00 | Author’s Interview (On-Site ONLY) & Break |
Session A-4: Invited & Yield & Defect Control (YD) & Manufacturing Technology for Variety Devices (VD)
Session Co-Chairs: Kenji Watanabe, Western Digital / Tomio Otsuki, JX Nippon Mining & Metals
| 17:20 |
Invited ONLINE IITC-01 : Dual Damascene 28nm‐Pitch Single Exposure EUV Design Rules Evaluation by Voltage Contrast Characterization Victor M. Carballo, IMEC |
| 17:40 |
ONLINE YD-35 : Automatic classification of C-SAM voids for root cause identification of bonding yield degradation Julien Baderot, Pollen Metrology |
| 18:00 |
VD-33 : Hydrogen diffusion behavior of CH4N-molecular-ion-implanted wafers for 3D-stacked CMOS image sensors Ryosuke Okuyama, SUMCO |
| 18:20 | Author’s Interview (On-Site ONLY) & Break |
| 18:40 |
Room2: KFC Hall Annex
Session B-1: Invited & Process/Material Optimization (PO)
Session Co-Chairs: Tsuyoshi Moriya, Tokyo Electron / Hiroyuki Inoue, Texas Instruments Japan
| 10:40 |
Invited EDTM-02 : Experimental Analysis of Process Impacts on Fluorine Incorporated Gate Oxide Film Properties Near Gate Edge Region Shuntaro Fujii, Asahi Kasei |
| 11:00 |
PO-63 : Nanoimprint Lithography with CO2 Ambient Toshiki ITO, Canon |
| 11:20 |
PO-11 : Impact of cation vacancies on leakage current on TiN/ZrO2/TiN capacitors studied by positron annihilation Akira Uedono, University of Tsukuba |
| 11:40 | Author’s Interview (On-Site ONLY) & Break |
| 12:00 | Sponsor Exhibition & Video (Sponosr: Silver-Platinum) / Lunch Break |
| 12:50 – 14:30 | Plenary Session |
Session B-2: Invited & Process/Material Optimization (PO)
Session Co-Chairs: Kazunori Kato, Advanced Interface Technology / Shun-ichiro Ohmi, Tokyo Institute of Technology
| 14:30 |
Invited ONLINE IITC-02 : TSV fabrication technology using direct electroplating of Cu on the electroless plated barrier metal Shoso Shingubara, Kansai University |
| 14:50 |
PO-42 : Ultra-fast Etching of Photoresist by Reactive Atmospheric-pressure Micro-Thermal Plasma Jet Hibiki Kato, Hiroshima University |
| 15:10 |
ONLINE PO-28 : Optimization of RF frequencies in dual-frequency capacitively coupled plasma apparatus using genetic algorithm (GA) and plasma simulation Shigeyuki Takagi, Tokyo University of Technology |
| 15:30 | Author’s Interview & Exhibition (On-Site) & Break |
Session B-3: Invited & Process/Material Optimization (PO)
Session Co-Chairs: Shun-ichiro Ohmi, Tokyo Institute of Technology / Yuji Yamada, KIOXIA
| 16:00 |
Invited EDTM-03 : Temperature Dependence of Current-Voltage Characteristics of Ionic Liquid Type Intelligent Connection Device Masakazu Kobayashi, Nagase |
| 16:20 |
PO-40 : Deposition rate dependence of the 5 nm-thick ferroelectric nondoped HfO2 on MFSFET characteristics Masakazu Tanuma, Tokyo Institute of Technology |
| 16:40 |
ONLINE PO-55 : Process Optimization for Ge-on-Si depletion mode transistors using mesa architecture Sumit Choudhary, Indian Institute of Technology, (IIT), Mandi |
| 17:00 | Author’s Interview (On-Site ONLY) & Break |
Session B-4: Material Informatics (MI) & New Gas, New Liquid, and New Resist Technologies (NM)
Session Co-Chairs: Shinsuke Mizuno, Applied Materials Japan / Takanori Kawakami, JSR
| 17:20 |
ONLINE MI-25 : Systematic search for stabilizing dopants in ZrO2 and HfO2 using first-principles calculations Yosuke Harashima, Nara Institute of Science and Technology |
| 17:40 |
NM-23 : Recent status of EUV lithography, what is the stochastic issues ? Toru Fujimori, FUJIFILM |
| 18:00 |
NM-45 : Technology Trends and Characteristics of Patent Information Disclosure in Advanced Semiconductor Photoresist Kosuke Watahiki, Yamaguchi University |
| 18:20 | Author’s Interview(On-Site ONLY) & Break |
| 18:40 |
DAY2 – December 13th
Room : KFC Hall
Plenary Session
| 8:30 | Registration |
| 8:50 | Program Outline by ISSM program Committee Chair |
| 9:00 |
ONLINE Keynote Speech-3 The Path to 100 Billion Goes Upward – IBM Research Semiconductors Technology Atlas Dr.Nelson Felix, IBM Session Chair: Yasutoshi Okuno, SCREEN Semiconductor Solutions |
| 9:40 | Break |
| 9:50 |
ONLINE Keynote Speech-4 A Requirements Driven Digital Framework to Support Semiconductor Manufacturing: Specifications and Opportunities Dr.James Moyne, AMAT / University of Michigan Session Chair: Shuichi Inoue, ATONARP |
| 10:30 | Break |
| 10:40 |
ONLINE Keynote Speech-5 Heterogeneous Integration Paving the way for Microelectronics Resurgence Mr.Timothy Lee, IEEE Board of Director IEEE HIR Chair for 5G Technical Working Group Session Chair: Kenji Miyake, PMT |
| 11:20 | Sponsor Exhibition & Video (Sponosr: Silver-Platinum) / Lunch Break |
| 12:10 |
Keynote Speech-6 Decarbonization Management to Improve Corporate Value Mr.Michitaka Tokeiji, Zeroboard. Inc Session Chair: Hiroshi Akahori, KIOXIA |
| 12:50 | Break |
| 13:00 |
AI Contest Award
Session Co-Chairs: Shin-ichi Imai, Hitachi High-Tech / Isamu Namose, OMRON |
| 14:00 | Break |
| 14:10 |
3mins Flash Presentation by Interactive Poster Speakers
Session Co-Chairs: Takanori Kawakami, JSR / Toshio Konishi, Toppan Photomask
|
| 14:40 | Sponsor Exhibition (On-site) & Break |
Room 1 : KFC Hall
Session A-5: Intelligent Data Management (ID)
Session Co-Chairs: Masami Aoki, KLA-Tencor Japan / Hiroyuki Inoue, Texas Instruments Japan
| 15:00 |
ID-13 : Advanced Process Control Model for Trench Shape of Power Devices Takumi Ito, TOSHIBA DEVICE & STORAGE |
| 15:20 |
ID-17 : Principal Component Analysis based GaN transistor live health monitoring Florian Chalvin, Rohm |
| 15:40 |
ONLINE ID-27 : Application of Big Data Science in High Reliability Automotive Wafer Yield Management System and Failure Analysis Chia-Cheng Kuo, Taiwan Semiconductor Co., Ltd. |
| 16:00 | Author’s Interview (ON-Site ONLY) & Break |
Session A-6: Intelligent Data Management (ID)
Session Co-Chairs:Yuji Yamada, KIOXIA / Takayuki Hisamatsu, Sony Semiconductor Manufacturing
| 16:20 |
ID-32 : Equipment Sensor Data Cleansing Algorithm Design for ML-Based Anomaly Detection Shi-Chung Chang, National Taiwan University |
| 16:40 |
ID-26 : Dynamic AI Computation Tasks with SECS/GEM in Semiconductor Smart Manufacturing Hung H Nguyen, Yield Engineering Systems |
| 17:00 |
ID-36 : Secure and Reliable Power Monitoring for Low Consumption Factory Equipment via Programmable IoT Devices Sergio Garnica, Fraunhofer Research Institution for Microsystems and Solid State Technologies EMFT |
| 17:20 | |
| 17:40 | Author’s Interview (ON-Site ONLY) & Break |
| 18:00 |
Poster Session (On-Site) |
| 18:25 | ISSM Awards |
| 18:40 |
Room2: KFC Hall Annex
Session B-5: Process Monitoring & Control Method (PM)
Session Co-Chairs: Takahiro Tsuchiya, United Semiconductor Japan / Takayuki Matsumoto, United Semiconductor Japan
| 15:00 |
PM-22 : Characterization of light propagation loss in Si Photonics using High-Resolution CDSEM metrology Shimon Halevi, Applied Materials |
| 15:20 |
PM-41 : In Situ Measurement and Analysis of Low Pressure Gas Concentration Distribution Using 70-dB SNR 1,000 Frames-per-second Absorption Imaging System Yushi Sakai, Tohoku University |
| 15:40 |
PM-18 : Advanced Process Monitoring through Fault Detection and Classification for Robust Statistical Process Control of Tantalum Nitride Reactive Sputtering Stephanie Y Chang, Skyworks Solutions |
| 16:00 | Author’s Interview (ON-Site ONLY) & Break |
Session B-6: Process Monitoring & Control Method (PM)
Session Co-Chairs: Shin-ichi Imai, Hitachi High-Tech / Tsuyoshi Moriya, Tokyo Electron
| 16:20 |
PM-30 : Plasma Process Classification using Causal Discovery Technique Dai Kobayashi, Tokyo Electron |
| 16:40 |
PM-14 : Practical load impedance monitoring system externally installed in plasma etching equipment Yuji Kasashima, National Institute of Advanced Industrial Science and Technology |
| 17:00 |
PM-31 : Plasma diagnostics and characteristics of hydrofluorocarbon films in capacitively coupled CF4/H2 plasmas Shih-Nan Hsiao, Nagoya University |
| 17:20 |
PM-49 : A Study on Robust Noninteracting Control System Design with Disturbance Feedforward for 6-DoF AVIS Thinh Huynh, Pukyong National University |
| 17:40 | Author’s Interview (ON-Site ONLY) & Break |
| 18:00 | Poster Session (On-Site ONLY) |
| 18:25 | ISSM Awards |
| 18:40 |