Important Date

• Abstract Submission Due: July 31,2026 (TBA)
• Notification of Acceptance: September 30, 2026 (TBA)

Areas of Interest

Fab Management

* Factory Design (FD)

* Manufacturing Strategy (MS)

* Manufacturing Control and Execution (MC)

* Environment, Safety and Health, Carbon Neutral (ES)

* Intelligent Data Management (ID)

Process Integration

* Process/Material Optimization (PO)

* Yield Enhancement and Methodology (YE)

* Ultraclean Technology and Contamination Control (UC)

* Process Monitoring and Control Method (PC)

* Process/Metrology Equipment (PE)

* Design for Manufacturing (DM)

* Innovative manufacturing technology(IM)

3D, Chiplets Packaging & Advanced Packaging

*3D Integration, Chiplets Packaging and Advanced Packaging Technology (TP)

Highlighted Themes

Robotics and AI Solution

– Autonomous Fab control by Big Data Science

– Advanced Material handling system, Automation of Maintenance

– Nobel sensing and data processing using AI/ML

Next Generation Fab

– Smart Factory and GX

– Sophisticated Transportation including PKG

– Physical Analysis Automation and Short Development Period

Sustainable Manufacturing and Promotion of Global Environmental Conservation

– High Energy Efficiency and Emission Reduction

– Return of Investment in Legacy Fab.

Exploring New Frontiers from Chip Design to Testing: 3D and Chiplets Packaging

– Glass substrate/TGV/Si bridge, 3D interconnection/hybrid bonding/Cu-Cu direct bonding, Interlayer dielectric materials/Sub-micron fine circuit formation technology, Chiplets Packaging technology, Module testing technology