International Symposium on Semiconductor Manufacturing
Date: December 7th – 8th, 2026
Venue: KFC (Kokusai Fashion Center) Hall
1-6-1 Yokoami Sumida-ku, Tokyo, 130-0015 Japan
+81-3-5610-5810
The International Symposium on Semiconductor Manufacturing (ISSM) is a premier conference for semiconductor manufacturing professionals dedicated to sharing technical solutions and opinions on the advancement of manufacturing science, technologies, and management disciplines. Since its start in 1992 in Japan, ISSM has been providing unique opportunities to share semiconductor manufacturing technology”, best practices” for the benefit of professionals worldwide.
ISSM aims to establish new concepts for semiconductor manufacturing technologies and to promote them as systemized and universalized technologies. ISSM brings together researchers and engineers involved in semiconductor manufacturing technology from a wide range of industries and universities, The two-day symposium includes keynote speeches, tutorial speeches, semiconductor manufacturing technologies sessions, interactive poster sessions, and supplier exhibits.
IMPORTANT DATE
- Abstract Submission Due: July 31,2026 (TBA)
- Notification of Acceptance: September 30, 2026 (TBA)
Areas of Interest
- Fab Management
- * Factory Design (FD)
- * Manufacturing Strategy (MS)
- * Manufacturing Control and Execution (MC)
- * Environment, Safety and Health, Carbon Neutral (ES)
- * Intelligent Data Management (ID)
- Process Integration
- * Process/Material Optimization (PO)
- * Yield Enhancement and Methodology (YE)
- * Ultraclean Technology and Contamination Control (UC)
- * Process Monitoring and Control Method (PC)
- * Process/Metrology Equipment (PE)
- * Design for Manufacturing (DM)
- * Innovative manufacturing technology(IM)
- 3D, Chiplets Packaging & Advanced Packaging
- *3D Integration, Chiplets Packaging and Advanced Packaging Technology (TP)
Areas of Interest Highlighted Themes
- Robotics and AI Solution
- – Autonomous Fab control by Big Data Science
- – Advanced Material handling system, Automation of Maintenance
- – Nobel sensing and data processing using AI/ML
- Next Generation Fab
- – Smart Factory and GX
- – Sophisticated Transportation including PKG
- – Physical Analysis Automation and Short Development Period
- Sustainable Manufacturing and Promotion of Global Environmental Conservation
- – High Energy Efficiency and Emission Reduction
- – Return of Investment in Legacy Fab.
- Exploring New Frontiers from Chip Design to Testing: 3D and Chiplets Packaging
- – Glass substrate/TGV/Si bridge, 3D interconnection/hybrid bonding/Cu-Cu direct bonding, Interlayer dielectric materials/Sub-micron fine circuit formation technology, Chiplets Packaging technology, Module testing technology