Japan Organizing Committee

Chairman

Shozo Saito, Device & System Platform Development Center Co., Ltd.

Vice Chairman

Shuichi Inoue, ATONARP INC.

Member

Toru Kimura, JSR Corporation
Junichi Wada, KIOXIA Corporation
Masayoshi Tarutani, Mitsubishi Electric Corporation
Michihiro Inoue, National Institute of Advanced Industrial Science and Technology (AIST)
Atsuyoshi Koike, Rapidus Corporation
Yasutoshi Okuno, SCREEN Holdings Co., Ltd.
Hayato Iwamoto, Sony Semiconductor Solutions Corporation
Takahito Matsuzawa, Tokyo Electron Ltd.
Hiroaki Kato, TOSHIBA ELECTRONIC DEVICES & STORAGE Corporation
Tomoyuki Sasaki, Tower Partners Semiconductor Co., Ltd.

Japan Executive Committee

Chairman

Ayako Shimazaki, Toshiba Nanoanalysis Corporation

Treasurer

Hiroaki Kato, TOSHIBA ELECTRONIC DEVICES & STORAGE Corporation

Member

Kensuke Uriga, Dura Systems, Inc.
Takeshi Hattori, Hattori Consulting International
Toshiyuki Uchino, Kokusai Electric Corporation
Masayoshi Tarutani, Mitsubishi Electric Corporation
Hiroyuki Chuma, Nisshinbo Holdings Inc.
Katsutoshi Ozawa, OMRON Corporation
Kazuya Okamoto, Osaka University / Nippon Institute of Technology
Hiroyuki Mori, Renesas Electronics Corporation
Takashi Shimane, Rohm Co., Ltd.
Yasutoshi Okuno, SCREEN Holdings Co., Ltd.
Hiroshi Akahori, Semilab Japan KK
Masahiko Hamajima, SEMI
Kiyoshi Watanabe, Semiconductor Equipment Association of Japan (SEAJ)
Hayato Iwamoto, Sony Semiconductor Solutions Corporation
Takahito Matsuzawa, Tokyo Electron, Ltd.
Tomoyuki Sasaki, Tower Partners Semiconductor Co., Ltd.

Japan Program Committee

Chairman

Shin-ichi Imai, Hitachi High-Tech Corporation

Executive Vice Chairman

Ayako Shimazaki, Toshiba Nanoanalysis Corporation

Committee leader

Kazunori Kato, Advanced Interface Technology Corporation
Isamu Namose, OMRON Corporation
Kazuhito Matsukawa, SUMCO Corporation
Yuki Yamada, JX Nippon Mining & Metals Corporation

ISSM Conference Editor for IEEE TSM

Tsuyoshi Moriya, Tokyo Electron Ltd.

Member

Shinsuke Mizuno, Applied Materials Japan, Inc
Satoko Nakagawa, GlobalWafers Japan Co., Ltd
Kazunori Nemoto, Hitachi High Technologies America, Inc.
Takanori Kawakami, JSR Corporation
Yuji Yamada, KIOXIA Corporation
Masami Aoki, KLA-Tencor Japan Ltd.
Masahiro Shimbo, ON Semiconductor
Kenji Miyake, Office Miyake
Kazuki Yokota, Renesas Electronics Corporation
Shoji Takei, Rohm Co., Ltd.
Kenji Watanabe, Rapidus Corporation
Takayuki Hisamatsu, Sony Semiconductor Manufacturing Corporation
Hiroyuki Inoue, Texas Instruments Japan Limited
Shun-ichiro Ohmi, Tokyo Institute of Technology
Toshio Konishi, Toppan Photomask Co., Ltd.
Takatoshi Yasui, Tower Partners Semiconductor Co., Ltd.
Takayuki Matsumoto, United Semiconductor Japan Co., Ltd.
Takahiro Tsuchiya, United Semiconductor Japan Co., Ltd.
Sumika Arima, University of Tsukuba

e-Manufacturing & Design Collaboration Conference (eMCD) Advisory Committee

Dr. Nicky C.C. Lu, Etron Technology, Inc.
Dr. TY Wu, TSIA
Ms. Celia Shih, TSIA
Mr. Thomas Chen, tsmc
Mr. Robert Chien, tsmc
Dr. C. Hsu, tsmc
Prof. SC Chang, National Taiwan University