About ISSM

ISSM HISTORY

ISSM’s mission is to achieve the continued prosperity of the semiconductor industry by bringing about breakthroughs in semiconductor manufacturing technologies through networking between engineers in research and development fields and their counterparts in the manufacturing field.

202229thISSM2022
KFC Hall, Tokyo Japan
December 12-13, 2022
2021Cancelled
202028thISSM2020
Virtual Symposium
December 15-16, 2020
201927the-Manufacturing & Design Collaboration Symposium -A Joint Symposium with ISSM 2019
The Ambassador Hotel Hsin Chu, Taiwan
September 6, 2019
201826thISSM2018
KFC Hall, Tokyo Japan
December 10-11, 2018
201725the-Manufacturing & Design Collaboration Symposium -A Joint Symposium with ISSM 2017
The Ambassador Hotel Hsin Chu, Taiwan
September 9, 2017
201624thISSM 2016
KFC Hall, Tokyo Japan
December 12-13, 2016
201523the-Manufacturing & Design Collaboration Symposium -A Joint Symposium with ISSM 2015
Taipei World Trade Center Nangang Exhibition Hall
September 2-3, 2015
201422thISSM 2014
Hyatt Regency Tokyo, Tokyo, Japan
December 2-3, 2014
201321the-Manufacturing & Design Collaboration Symposium -A Joint Symposium with ISSM 2013
The Ambassador Hotel Hsin Chu, Taiwan
201220thISSM 2012
Hyatt Regency Tokyo, Tokyo, Japan
October 15-17, 2012
201119the-Manufacturing & Design Collaboration Symposium -A Joint Symposium with ISSM 2011
The Ambassador Hotel Hsin Chu, Taiwan
September 5-6, 2011
201018thISSM2010
Hyatt Regency Tokyo, Tokyo, Japan
October 18-20, 2010
2009Cancelled
200817thISSM2008
Hyatt Regency Tokyo, Tokyo, Japan
October 18-20, 2010
200716thISSM2007
Marriott Hotel, Santa Clara, California USA
October 15-17, 2007
200615thISSM 2006
Hyatt Regency Tokyo, Tokyo, Japan
September 25-27, 2006
200514thISSM2005
Fairmont Hotel, San Jose, California, USA
September 13-15, 2005
200413thISSM2004
Keio Plaza Hotel, Tokyo, Japan
September 27-29, 2004
200312thISSM2003
San Jose, California, USA
September 30 – October 2, 2003
200211thISSM2002
October 15-17,2002
Japan
200110thISSM2001
SanJose,California, USA
October 8-10, 2001
20009thISSM2000
September 26-28, 2000
Toshi Center Hotel, Tokyo, Japan
Zenkoku Toshi Kaikan, Tokyo, Japan
19998th
19987thISSM1998
Hotel East 21 Tokyo, Tokyo, Japan
October 7-9, 1998
19976th
19965thISSM1996
Hotel East 21 Tokyo, Tokyo, Japan
October 2-4, 1996
19954thISSM1995
Austin, Texas, USA
September 17-19, 1995
19943rdISSM1994
TOSHO HALL
June 21-22, 1994
19932ndAustin, Texas, USA
September 20-21, 1993
19921stISSM1992
The Hotel New Otani, Tokyo, Japan
May 14-15, 1992

ISSM BACKGROUND

The semiconductor industry has brought about a dramatic transformation to society in the half century since the invention of the transistor. In much the same way as the revolution that brought transistors to integrated circuits, the system LSI is a concept that will bring a paradigm shift that will impact across the global semiconductor, IT and electronics related industries. With the advent of the system LSI, in addition to the importance of scaling rules based technology development, it is now essential to establish a new scheme for semiconductor manufacturing technologies in order to meet requirements for system LSIs as technologies for a ubiquitous network society.

The semiconductor industry is going through a big transition to meet this change. As an industry heavily dependent on its manufacturing capability and productivity, the industry is shifting from an integrated device manufacturing model to more horizontal specialized manufacturing processes, as well as pursuing manufacturing cost reductions with 300mm wafer transition, a step-by-step investment approach, and the introduction of customized, small/medium quantity production methods. The key words for competitive SoC manufacturing technologies are high quality, low cost, and high efficiency. Furthermore, environmental considerations are also becoming an important consideration for semiconductor manufacturing processes.

Semiconductor manufacturing technology is reliant on the sum of the total of engineers’ experiences and the accumulation of know-how and IP. The complexity of the field prevents a shift to the systematization and universalization of technologies. In order to bring breakthroughs in semiconductor manufacturing to reflect changing and challenging new requirements, the International Symposium on Semiconductor Manufacturing (ISSM) was launched in 1992.

ISSM is an annual conference of semiconductor manufacturing professionals dedicated to sharing technical solutions and opinions on the advancement of manufacturing science, technologies, and management disciplines. ISSM aims to establish new concepts for semiconductor manufacturing technologies and to promote them as systemized and universalized technologies. ISSM’s role has been to challenge the concept of shifting from “know-how” to “science” in semiconductor manufacturing technologies. The past twelve annual symposia have helped to shape the course of development of “manufacturing science,” as well as to create new manufacturing technologies.

The Symposium is held under the joint sponsorship of the Society of Applied Physics of Japan, the IEEE Electron Devices Society, Semiconductor Equipment and Materials International (SEMI), and Taiwan Semiconductor Industry Association (TSIA). ISSM, with its global range, continuously pushes technological development in order to promote the discovery and utilization of innovative technologies. ISSM’s mission is to achieve the continued prosperity of the semiconductor industry by bringing about breakthroughs in semiconductor manufacturing technologies through networking between engineers in research and development fields and their counterparts in the manufacturing field.

ISSM Sponsors

Co Sponsored by: IEEE Electron Devices Society, Minimal Fab

ISSM 2022 / Co-Sponsored by: IEEE Electron Devices Society, Minimal Fab

ISSM Supporters

Supported by Semiconductor Equipment Association of Japan (SEAJ),Semiconductor Equipment and Materials International (SEMI) and Taiwan Semiconductor Industry Association (TSIA)

ISSM 2022 / Supported by SEAJ,SEMI and TSIA

Endorsement by The Japan Institute of Electronics Packaging, The Japan Society of Applied Physics

ISSM 2022 / Endorsement by The Japan Institute of Electronics Packaging, The Japan Society of Applied Physics

Global Partner

e-Manufacturing Design Collaboration Symposium (eMDC)

In conjunction with

Contact to issm_2022@semiconportal.com for further inquiries.