ISSM HISTORY
ISSM’s mission is to achieve the continued prosperity of the semiconductor industry by bringing about breakthroughs in semiconductor manufacturing technologies through networking between engineers in research and development fields and their counterparts in the manufacturing field.
| 2024 | 30th | ISSM 2024 KFC Hall, Tokyo Japan December 9-10, 2024 |
| 2022 | 29th | ISSM 2022 KFC Hall, Tokyo Japan December 12-13, 2022 |
| 2021 | Cancelled | |
| 2020 | 28th | ISSM2020 Virtual Symposium December 15-16, 2020 |
| 2019 | 27th | e-Manufacturing & Design Collaboration Symposium -A Joint Symposium with ISSM 2019 The Ambassador Hotel Hsin Chu, Taiwan 6-Sep-19 |
| 2018 | 26th | ISSM 2018KFC Hall, Tokyo Japan December 10-11, 2018 |
| 2017 | 25th | e-Manufacturing & Design Collaboration Symposium -A Joint Symposium with ISSM 2017 The Ambassador Hotel Hsin Chu, Taiwan September 9, 2017 |
| 2016 | 24th | ISSM 2016 KFC Hall, Tokyo Japan December 12-13, 2016 |
| 2015 | 23th | e-Manufacturing & Design Collaboration Symposium -A Joint Symposium with ISSM 2015 Taipei World Trade Center Nangang Exhibition Hall September 2-3, 2015 |
| 2014 | 22th | ISSM 2014 Hyatt Regency Tokyo, Tokyo, Japan December 2-3, 2014 |
| 2013 | 21th | e-Manufacturing & Design Collaboration Symposium -A Joint Symposium with ISSM 2013 The Ambassador Hotel Hsin Chu, Taiwan |
| 2012 | 20th | ISSM 2012 Hyatt Regency Tokyo, Tokyo, Japan October 15-17, 2012 |
| 2011 | 19th | e-Manufacturing & Design Collaboration Symposium -A Joint Symposium with ISSM 2011 The Ambassador Hotel Hsin Chu, Taiwan September 5-6, 2011 |
| 2010 | 18th | ISSM 2010 Hyatt Regency Tokyo, Tokyo, Japan October 18-20, 2010 |
| 2009 | Cancelled | |
| 2008 | 17th | ISSM 2008 Hyatt Regency Tokyo, Tokyo, Japan October 27-29, 2008 |
| 2007 | 16th | ISSM 2007 Marriott Hotel, Santa Clara, California USA October 15-17, 2007 |
| 2006 | 15th | ISSM 2006 Hyatt Regency Tokyo, Tokyo, Japan September 25-27, 2006 |
| 2005 | 14th | ISSM 2005 Fairmont Hotel, San Jose, California, USA September 13-15, 2005 |
| 2004 | 13th | ISSM 2004 Keio Plaza Hotel, Tokyo, Japan September 27-29, 2004 |
| 2003 | 12th | ISSM 2003 San Jose, California, USA September 30 – October 2, 2003 |
| 2002 | 11th | ISSM 2002 October 15-17,2002 Japan |
| 2001 | 10th | ISSM 2001 SanJose,California, USA October 8-10, 2001 |
| 2000 | 9th | ISSM 2000 September 26-28, 2000 Toshi Center Hotel, Tokyo, Japan Zenkoku Toshi Kaikan, Tokyo, Japan |
| 1999 | 8th | |
| 1998 | 7th | ISSM1998 Hotel East 21 Tokyo, Tokyo, Japan October 7-9, 1998 |
| 1997 | 6th | |
| 1996 | 5th | ISSM 1996 Hotel East 21 Tokyo, Tokyo, Japan October 2-4, 1996 |
| 1995 | 4th | ISSM 1995 Austin, Texas, USA September 17-19, 1995 |
| 1994 | 3rd | ISSM 1994 TOSHO HALL June 21-22, 1994 |
| 1993 | 2nd | Austin, Texas, USA September 20-21, 1993 |
| 1992 | 1st | ISSM 1992 The Hotel New Otani, Tokyo, Japan May 14-15, 1992 |
ISSM BACKGROUND
The semiconductor industry has brought about a dramatic transformation to society in the half century since the invention of the transistor. In much the same way as the revolution that brought transistors to integrated circuits, the system LSI is a concept that will bring a paradigm shift that will impact across the global semiconductor, IT and electronics related industries. With the advent of the system LSI, in addition to the importance of scaling rules based technology development, it is now essential to establish a new scheme for semiconductor manufacturing technologies in order to meet requirements for system LSIs as technologies for a ubiquitous network society.
The semiconductor industry is going through a big transition to meet this change. As an industry heavily dependent on its manufacturing capability and productivity, the industry is shifting from an integrated device manufacturing model to more horizontal specialized manufacturing processes, as well as pursuing manufacturing cost reductions with 300mm wafer transition, a step-by-step investment approach, and the introduction of customized, small/medium quantity production methods. The key words for competitive SoC manufacturing technologies are high quality, low cost, and high efficiency. Furthermore, environmental considerations are also becoming an important consideration for semiconductor manufacturing processes.
Semiconductor manufacturing technology is reliant on the sum of the total of engineers’ experiences and the accumulation of know-how and IP. The complexity of the field prevents a shift to the systematization and universalization of technologies. In order to bring breakthroughs in semiconductor manufacturing to reflect changing and challenging new requirements, the International Symposium on Semiconductor Manufacturing (ISSM) was launched in 1992.
ISSM is an annual conference of semiconductor manufacturing professionals dedicated to sharing technical solutions and opinions on the advancement of manufacturing science, technologies, and management disciplines. ISSM aims to establish new concepts for semiconductor manufacturing technologies and to promote them as systemized and universalized technologies. ISSM’s role has been to challenge the concept of shifting from “know-how” to “science” in semiconductor manufacturing technologies. The past twelve annual symposia have helped to shape the course of development of “manufacturing science,” as well as to create new manufacturing technologies.
The Symposium is held under the joint sponsorship of the Society of Applied Physics of Japan, the IEEE Electron Devices Society, Semiconductor Equipment and Materials International (SEMI), and Taiwan Semiconductor Industry Association (TSIA). ISSM, with its global range, continuously pushes technological development in order to promote the discovery and utilization of innovative technologies. ISSM’s mission is to achieve the continued prosperity of the semiconductor industry by bringing about breakthroughs in semiconductor manufacturing technologies through networking between engineers in research and development fields and their counterparts in the manufacturing field.
ISSM Sponsors
Co Sponsored by: IEEE Electron Devices Society, MINIMAL(Minimal Fab Promoting Organization)
ISSM Supporters
Supported by Semiconductor Equipment Association of Japan (SEAJ),Semiconductor Equipment and Materials International (SEMI) and Taiwan Semiconductor Industry Association (TSIA)
Endorsement by The Japan Institute of Electronics Packaging, The Japan Society of Applied Physics
