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The abstract submission deadline is extended to August 21,2026.
ISSM 2026 Abstract Template
ISSM 2026 Abstract Template (MS WORD)
Prospective authors are invited to submit two-page manuscripts, including figures, tables and references to the official ISSM website.
Prepare the submission in PDF format using the template.
And note that please avoid commercial aspects as much as possible.
Papers accepted either oral or poster as regular submissions are eligible for consideration for the Best Paper Award.
Papers accepted as regular submission require full paper in four pages to be submitted by November 16.
The full paper will be published in the digital proceedings of ISSM 2026 AND IEEE Xplore.
ISSM2026 Late News Abstract Template (MS WORD) NEW!
ISSM 2026 has introduced a new “Late News” submission with the aim of quickly sharing cutting-edge research results and important recent findings, thereby further stimulating discussion. By providing an opportunity to present new developments that have emerged after the regular submission deadline or recent trends, we aim to enhance the quality of academic exchange and provide a forum for more timely information sharing.
Prospective authors are invited to submit one-page manuscript, including figures, tables and references to the official ISSM website.
Prepare the submission in PDF format using the template.
And note that please avoid commercial aspects as much as possible.
Papers accepted either oral or poster as Late News submissions are NOT eligible for consideration for the Best Paper Award basically.
Papers accepted as Late News require full paper in four pages to be submitted by November 16.
The full paper will be published in the digital proceedings of ISSM 2026 AND IEEE Xplore.
Important Date
- Extended Deadline for Regular Submission: August 21, 2026
- Submission Deadline for Late News Submission: September 11, 2026
- Notification of Acceptance:
September 30, 2026October 7, 2026 - Submission Deadline for Full Paper (Both for Regular and Late News): November 16, 2026
- Full Paper Publication: December 7, 2026
- Expected Publication in IEEE Xplore: Late January 2027
Areas of Interest
- Fab Management
- * Factory Design (FD)
- * Manufacturing Strategy (MS)
- * Manufacturing Control and Execution (MC)
- * Environment, Safety and Health, Carbon Neutral (ES)
- * Intelligent Data Management (ID)
- Process Integration
- * Process/Material Optimization (PO)
- * Yield Enhancement and Methodology (YE)
- * Ultraclean Technology and Contamination Control (UC)
- * Process Monitoring and Control Method (PC)
- * Process/Metrology Equipment (PE)
- * Design for Manufacturing (DM)
- * Innovative manufacturing technology(IM)
- 3D, Chiplets Packaging & Advanced Packaging
- *3D Integration, Chiplets Packaging and Advanced Packaging Technology (TP)
Highlighted Themes
- Robotics and AI Solution
- – Autonomous Fab control by Big Data Science
- – Advanced Material handling system, Automation of Maintenance
- – Nobel sensing and data processing using AI/ML
- Next Generation Fab
- – Smart Factory and GX
- – Sophisticated Transportation including PKG
- – Physical Analysis Automation and Short Development Period
- Sustainable Manufacturing and Promotion of Global Environmental Conservation
- – High Energy Efficiency and Emission Reduction
- – Return of Investment in Legacy Fab.
- Exploring New Frontiers from Chip Design to Testing: 3D and Chiplets Packaging
- – Glass substrate/TGV/Si bridge, 3D interconnection/hybrid bonding/Cu-Cu direct bonding, Interlayer dielectric materials/Sub-micron fine circuit formation technology, Chiplets Packaging technology, Module testing technology
- Substrate Surface Cleaning Technology (with the cooperation of the Interfacial Nano Electrochemistry: INE)
- -Wet Process, High-Purity Material Processing, Contamination analysis, Clean Manufacturing Environment