Cutting Edge Technologies of Power Semiconductor Device Applications for Electric Vehicle’s Power Electronics Systems in Japan, US, Europe and China Case
Prof. Masayoshi Yamamoto
Institute of Materials and Systems for Sustainability (IMaSS),
Graduate School of Engineering and School of Engineering,
Department of Electrical Engineering,
Furthermore, the possibility of SiC and GaN power semiconductor applications for EV will be discussed from the experimental point of views in case of the main inverter, 3-phase inverter for the compressors, the on-board charger and the isolated DC-DC converter.
The Contribution and Expectation of TSMC Japan 3DIC R&D Center to Japan Industry
Only live presentations are available. No Q&A.
No recordings or on-demand.
Mr. Yutaka Emoto
TSMC Japan 3DIC R&D Center, Inc.
With the advent of 3D IC and associated packaging technology, semiconductor industry has focused not only on SoC scaling to follow Moore’s Law, but also concurrently focused on chiplet integration through 2.5D and 3D stacking technologies to increase circuit densities as alternative approaches to catch up with classic Moore’s Law and intended to further extend Moore’s Law through innovative chiplet integration evolutions. In TSMC, advanced 3DFabric platforms, CoWoS family and INFO family, have been developed and widely adopted by global semiconductor industry.
TSMC established its Japan 3DIC R&D Center subsidiary in March 2021 and completed the clean room construction this June. TSMC Japan 3DIC R&D Center will support research and development of state-of-the-art 3D IC packaging material. Connecting our Japanese partners possessing strengths in semiconductor materials, substrate, and equipment, to TSMC’s worldwide customers, we look forward to creating a new market of 3D Fabric and 3D IC and contributing to semiconductor industry in Japan.
After joining J-Devices in 2018, he led the company as the President and Representative Director during the economy recession period.
He joined TSMC in 2021 to establish Japan 3DIC R&D Center and successfully moving forward to the R&D business activities after the Opening Ceremony in June.
Emoto Graduated from the University of KEIO with a degree in Engineering.
The Path to 100 Billion Goes Upward – IBM Research Semiconductors Technology Atlas
Dr. Nelson Felix
Director, Process Technology
A Requirements Driven Digital Twin Framework to Support Semiconductor Manufacturing: Specifications and Opportunities
Dr. James Moyne
Dr. James Moyne, Ph. D.
Associate Research Scientist, Mechanical Engineering Department
University of Michigan
Consultant for Standards and Technology, Advanced Services Engineering , Applied Global Services, Applied Materials
Heterogeneous Integration Paving the way for Microelectronics Resurgence
Mr. Timothy Lee
IEEE Board of Director
IEEE HIR Chair for 5G Technical Working Group
- Member of the IEEE Board of Directors
- Director of IEEE Region 6 (Western US)
- Member of IEEE Industrial Engagement Committee
- Member of IEEE New Initiative Committee
- Co-Chair of IEEE Future Networks Initiative
- IEEE Heterogenous Integration Roadmap
- Co-Chair of Aerospace & Defense TWG
- Co-Chair of the 5G / mm-waves TWG
- President of IEEE Microwave Theory and Technology Society (2015)
Decarbonization Management to Improve Corporate Value
Mr. Michitaka Tokeiji
Founder and CEO, Zeroboard. Inc
Scope 3 is the amount of CO2 emissions from supply chains other than the company’s own activities. For example, how much CO2 is emitted by the providers of goods and services procured in the course of corporate activities (Scope 3 upstream) and how much CO2 is emitted by the goods and services sold by the company (Scope 3 downstream).
In this presentation, we will explain the intention behind the disclosure of CO2 emissions, including Scope 3, and its impact on the entire supply chain, so that it can be used for strategic planning for decarbonization management.